C8051T615-GM Silicon Laboratories Inc, C8051T615-GM Datasheet - Page 30
C8051T615-GM
Manufacturer Part Number
C8051T615-GM
Description
IC 8051 MCU 8K BYTE-PROG 28-QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051T61xr
Specifications of C8051T615-GM
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
25
Program Memory Size
8KB (8K x 8)
Program Memory Type
OTP
Ram Size
1.25K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
Processor Series
C8051T6x
Core
8051
Data Bus Width
8 bit
Data Ram Size
1.25 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
29
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051FT610DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 21 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Other names
336-1442-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2x2 array of 1.10mm x 1.10mm openings on a 1.30mm pitch should be used for the center
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
pad.
Small Body Components.
Figure 6.2. QFN-24 Recommended PCB Land Pattern
Table 6.2. QFN-24 PCB Land Pattern Dimesions
3.90
3.90
0.20
Min
0.50 BSC
Max
4.00
4.00
0.30
Rev 1.0
Dimension
X2
Y1
Y2
2.70
0.65
2.70
Min
Max
2.80
0.75
2.80
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