AT91M55800A-33AU Atmel, AT91M55800A-33AU Datasheet - Page 25

• Manufacturer Part Number: AT91M55800A-33AU
• Description: IC ARM MCU 33MHZ 176-LQFP
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91M55800A-33AU

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, WDT
• Number Of I /o: 58
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LQFP
• Cpu Family: 91M
• Device Core: ARM7TDMI
• Device Core Size: 32b
• Frequency (max): 33MHz
• Interface Type: EBI/SPI/USART
• Program Memory Size: Not Required
• Total Internal Ram Size: 8KB
• # I/os (max): 58
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 176
• Package Type: LQFP
• Processor Series: AT91Mx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 58
• Number Of Timers: 10 bit
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91EB55
• Minimum Operating Temperature: - 40 C
• For Use With: AT91EB55 - KIT EVAL FOR ARM AT91M55800A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

10. Soldering Profile
10.1
10.2
1745FS–ATARM–18-Apr-06
LQFP Soldering Profile (Green)
BGA Soldering Profile (RoHS-compliant)
Table 10-1
Table 10-1.
Note:
A maximum of three reflow passes is allowed per component.
Table 10-2
Table 10-2.
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5 C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
Profile Feature
Average Ramp-up Rate (183 C to Peak)
Preheat Temperature 125 C ±25 C
Temperature Maintained Above 183 C
Time within 5 C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
The package is certified to be backward compatible with Pb/Sn soldering profile.
It is recommended to apply a soldering temperature higher than 250°C.
gives the recommended soldering profile from J-STD-020C.
gives the recommended soldering profile from J-STD-20C.
Soldering Profile Green Compliant Package
Soldering Profile RoHS Compliant Package
AT91M55800A Summary
Green Package
3 C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260 +0 C
6 C/sec. max.
8 min. max.
Convection or IR/Convection
3 C/sec. max.
180 sec. max
60 sec. to 150 sec.
20 sec. to 40 sec.
260 + 0 C
6 C/sec.
8 min. max
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