PIC16C74B-04/L Microchip Technology, PIC16C74B-04/L Datasheet - Page 5

• Manufacturer Part Number: PIC16C74B-04/L
• Description: IC MCU OTP 4KX14 A/D PWM 44PLCC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C74B-04/L

• Program Memory Type: OTP
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 44-PLCC
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 33
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 192 B
• Interface Type: I2C/SPI/USART
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 3
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: 0 C
• On-chip Adc: 8-ch x 8-bit
• Data Rom Size: 192 B
• Height: 3.87 mm
• Length: 16.59 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3.65 V
• Width: 16.59 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA16XL441 - ADAPTER DEVICE ICE 44PLCC309-1040 - ADAPTER 44-PLCC ZIF TO 40-DIP309-1039 - ADAPTER 44-PLCC TO 40-DIP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

FIGURE 4:
 2003 Microchip Technology Inc.
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
Drawing No. C04-114
A1
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: mMO-220
CH X 45°
28-PIN QFN PACKAGE (DRAWING 1, PACKAGING)
α
TOP VIEW
Dimension Limits
E1
E
Units
CH
D1
D2
A2
A1
A3
E1
E2
n
A
E
D
B
R
Q
α
n
p
L
2
1
MIN
A2
D1
.000
.140
.140
.009
.020
.005
.012
.009
A3
PIC16C63A/65B/73B/74B
D
A
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
.008 REF
NOM
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
D2
28
R
MAX
EXPOSED
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
12°
METAL
PADS
BOTTOM VIEW
MIN
E2
0.00
3.55
3.55
0.23
0.50
0.13
0.30
0.24
MILLIMETERS*
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
0.20 REF
NOM
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
28
DS80048C-page 5
MAX
Q
B
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
p
12°