PIC16C55-HS/SO Microchip Technology, PIC16C55-HS/SO Datasheet - Page 177

• Manufacturer Part Number: PIC16C55-HS/SO
• Description: IC MCU OTP 512X12 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C55-HS/SO

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 20
• Program Memory Type: OTP
• Ram Size: 24 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC16C
• No. Of I/o's: 20
• Ram Memory Size: 24Byte
• Cpu Speed: 20MHz
• No. Of Timers: 1
• Digital Ic Case Style: SOIC
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 24 B
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 20
• Number Of Timers: 8
• Operating Supply Voltage: 2 V to 6.25 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164002 - MODULE SKT PROMATEII 18/28SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16C55-HS/SOR; PIC16C55-HS/SOR

28-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-079
n
eB
E1
E
Dimension Limits
§
2
1
D
Units
c
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
A1
A
MIN
1.395
Preliminary
.160
.140
.015
.595
.505
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
1.430
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
28
10
10
MAX
B
1.465
B1
.190
.160
.625
.560
.135
.015
.070
.022
.680
15
15
MIN
15.75
12.83
35.43
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
NOM
15.24
13.84
36.32
16.51
PIC16C5X
p
2.54
4.45
3.30
0.29
1.27
0.46
3.81
28
10
10
A2
DS30453D-page 175
MAX
15.88
14.22
17.27
37.21
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15