PIC16C711-20I/P Microchip Technology, PIC16C711-20I/P Datasheet - Page 2

• Manufacturer Part Number: PIC16C711-20I/P
• Description: IC MCU OTP 1KX14 A/D 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C711-20I/P

• Program Memory Type: OTP
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 13
• Ram Size: 68 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 68 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 1
• Operating Supply Voltage: 2.5 V to 6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4 bit
• Data Rom Size: 68 B
• Height: 3.3 mm
• Length: 22.86 mm
• Supply Voltage (max): 6 V
• Supply Voltage (min): 4 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16C710/711
Clarifications/Corrections to the Data
Sheet:
1.
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS80154A-page 2
Module: Packaging
The package information contained in the data
sheet is incorrect. Please refer to the following
tables for correct package data.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
β
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
A2
E1
B1
eB
A1
D
A
E
L
B
α
n
p
c
β
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
 2003 Microchip Technology Inc.
NOM
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
α
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15