ATTINY2313A-MMH Atmel, ATTINY2313A-MMH Datasheet - Page 13

IC MCU AVR 2K FLASH 20QFN

ATTINY2313A-MMH

Manufacturer Part Number
ATTINY2313A-MMH
Description
IC MCU AVR 2K FLASH 20QFN
Manufacturer
Atmel
Series
AVR® ATtinyr
Datasheets

Specifications of ATTINY2313A-MMH

Core Processor
AVR
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
18
Program Memory Size
2KB (1K x 16)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Processor Series
ATtiny
Core
AVR
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
18
Number Of Timers
2
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATTINY2313A-MMH
Manufacturer:
SAMSUNG
Quantity:
101
7. Packaging Information
7.1
8246AS–AVR–11/09
SEATING PLANE
Notes:
20P3
R
2325 Orchard Parkway
San Jose, CA 95131
1. This package conforms to JEDEC reference MS-001, Variation AD.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
A
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
L
e
C
TITLE
20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual
Inline Package (PDIP)
eB
E
D
B1
eC
PIN
1
B
A1
E1
SYMBOL
A
A1
D
E
E1
B
B1
L
C
eB
eC
e
25.493
0.381
7.620
0.356
1.270
2.921
0.203
0.000
6.096
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
NOM
2.540 TYP
DRAWING NO.
10.922
25.984
5.334
0.559
1.551
3.810
0.356
1.524
8.255
7.112
MAX
20P3
Note 2
Note 2
NOTE
1/12/04
REV.
C
13

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