LPC2364FBD100,551 NXP Semiconductors, LPC2364FBD100,551 Datasheet - Page 37

• Manufacturer Part Number: LPC2364FBD100,551
• Description: IC ARM7 MCU FLASH 128K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 34 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 100LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1022 - BOARD SCKT ADAPTER FOR TFBGA100568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2622-1019 - BOARD FOR LPC2106 48-LQFP568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3995; 935282463551; LPC2364FBD100-S

NXP Semiconductors
8. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
LPC2364_65_66_67_68_6
Product data sheet
Symbol
V
V
V
V
V
V
V
I
I
T
P
V
DD
SS
stg
DD(3V3)
DD(DCDC)(3V3)
DDA
i(VBAT)
i(VREF)
IA
I
tot(pack)
ESD
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Including voltage on outputs in 3-state mode.
Not to exceed 4.6 V.
The peak current is limited to 25 times the corresponding maximum current.
Dependent on package type.
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
otherwise noted.
Limiting values
Parameter
supply voltage (3.3 V)
DC-to-DC converter supply voltage
(3.3 V)
analog 3.3 V pad supply voltage
input voltage on pin VBAT
input voltage on pin VREF
analog input voltage
input voltage
supply current
ground current
storage temperature
total power dissipation (per package)
electrostatic discharge voltage
Rev. 06 — 1 February 2010
Conditions
core and external
rail
for the RTC
on ADC related
pins
5 V tolerant I/O
pins; only valid
when the V
supply voltage is
present
other I/O pins
per supply pin
per ground pin
based on package
heat transfer, not
device power
consumption
human body
model; all pins
DD(3V3)
[1]
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
[2][3]
[2]
[4]
[4]
[5]
[6]
Min
3.0
3.0
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
-
-
−40
-
−2500
Max
3.6
3.6
+4.6
+4.6
+4.6
+5.1
+6.0
V
0.5
100
100
+125
1.5
+2500
DD(3V3)
© NXP B.V. 2010. All rights reserved.
+
SS
Unit
V
V
V
V
V
V
V
V
mA
mA
°C
W
V
unless
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