DSPIC30F5013-30I/PT Microchip Technology, DSPIC30F5013-30I/PT Datasheet - Page 191

• Manufacturer Part Number: DSPIC30F5013-30I/PT
• Description: IC DSPIC MCU/DSP 66K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F5013-30I/PT

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 66KB (22K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TFQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 68
• Flash Memory Size: 66KB
• Supply Voltage Range: 2.5V To 5.5V
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 68
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F501330IPT

FIGURE 23-16:
TABLE 23-33: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
© 2011 Microchip Technology Inc.
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
No.
Note: Refer to
2:
3:
(CKP = 0)
(CKP = 1)
SDI
SDI
SS
SCK
SCK
SDO
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ
X
TscH2ssH
TscL2ssH
X
Symbol
X
X
X
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPI pins.
Figure 23-3
SCK
SCK
SCK
SCK
SDO
SDO
SDO
SCK
Setup Time of SDI
SCK
Hold Time of SDI
to SCK
SS
SS
High-Impedance
SS
SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SP50
X
X
X
↓ to SCK
↑ to SDO
X
X
X
X
X
X
X
X
X
after SCK Edge
Edge
Data Output Valid after
Input Low Time
Input High Time
Input Fall Time
Input Rise Time
Edge
Data Output Fall Time
Data Output Rise Time
X
SP35
Characteristic
Edge
SP71
for load conditions.
SP40
X
↑ or SCK
X
Output
MSb IN
(3)
X
MSb
X
SP41
SP70
Data Input
Data Input to
(3)
(3)
(1)
X
SP30,SP31
↓ Input
(3)
(3)
BIT14 - - - - - -1
BIT14 - - - -1
1.5 T
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
120
+40
30
30
20
20
10
—
—
—
—
—
CY
dsPIC30F5011/5013
SP73
SP72
Typ
10
10
—
—
—
—
—
—
—
—
—
—
(2)
SP72
SP73
Max
25
25
30
50
—
—
—
—
—
—
—
—
LSb
LSb IN
SP52
-40°C ≤ T
-40°C ≤ T
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
SP51
A
A
See Parameter
See Parameter
≤ +85°C for Industrial
≤ +125°C for Extended
Conditions
DS70116J-page 191
DO32
DO31