PIC18LF2550-I/SO Microchip Technology, PIC18LF2550-I/SO Datasheet - Page 406
PIC18LF2550-I/SO
Manufacturer Part Number
PIC18LF2550-I/SO
Description
IC PIC MCU FLASH 16KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XR1.pdf
(438 pages)
3.PIC18F2221-ISO.pdf
(46 pages)
4.PIC18F2455-ISO.pdf
(14 pages)
5.PIC18F2455-ISO.pdf
(8 pages)
6.PIC18F2455-ISO.pdf
(26 pages)
7.PIC18F4550-IP.pdf
(430 pages)
8.PIC18LF2455-ISO.pdf
(430 pages)
Specifications of PIC18LF2550-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI/I2C/EAUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163025, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PCM18XR1 PDF datasheet #2
- PIC18F2221-ISO PDF datasheet #3
- PIC18F2455-ISO PDF datasheet #4
- PIC18F2455-ISO PDF datasheet #5
- PIC18F2455-ISO PDF datasheet #6
- PIC18F4550-IP PDF datasheet #7
- PIC18LF2455-ISO PDF datasheet #8
- Current page: 406 of 430
- Download datasheet (8Mb)
PIC18F2455/2550/4455/4550
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS39632C-page 404
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
§
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
Preliminary
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
28
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
28
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8
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