PIC16F87-I/SS Microchip Technology, PIC16F87-I/SS Datasheet - Page 29

• Manufacturer Part Number: PIC16F87-I/SS
• Description: IC MCU FLASH 4KX14 EEPROM 20SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F87-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 20-SSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: SSP/USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC164307 - MODULE SKT FOR PM3 28SSOP
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.8
1997 Microchip Technology Inc.
Related Application Notes
This section lists application notes that are related to this section of the manual. These applica-
tion notes may not be written specifically for the PIC16CXXX Mid-Range MCU family (that is they
may be written for the Base-Line, or the High-End families), but the concepts are pertinent, and
could be used (with modification and possible limitations). The current application notes related
to an introduction to Microchip’s PICmicro MCUs are:
Title
A Comparison of Low End 8-bit Microcontrollers
PIC16C54A EMI Results
Continuous Improvement
Improving the Susceptibility of an Application to ESD
Plastic Packaging and the Effects of Surface Mount Soldering Techniques
Section 1. Introduction
Application Note #
DS31001A-page 1-17
AN520
AN577
AN503
AN595
AN598
1