PIC18F24K20-E/SO Microchip Technology, PIC18F24K20-E/SO Datasheet - Page 2

• Manufacturer Part Number: PIC18F24K20-E/SO
• Description: IC PIC MCU FLASH 8KX16 28-SOIC
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F24K20-E/SO

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Core Processor: PIC
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 25
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 64MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: CCP, ECCP, EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 11 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18F24K20/25K20/44K20/45K20
TABLE 2:
DS80425G-page 2
ECCP
ECCP
MSSP SPI
MSSP I
ADC
MSSP I
MSSP I
MSSP SPI
MSSP SPI
MSSP SPI
EUSART
EUSART
EUSART
Internal Fixed
Voltage Refer-
ence (FVR)
High Low Voltage
Detect (HLVD)
BOR
System Clocks
POR/BOR
POR
POR
Clocks
Comparators
Data EEPROM
Memory
Program Flash
Memory
Configuration Bits
Note 1:
Module
2:
2
2
2
C™
C
C
Only those issues indicated in the last column apply to the current silicon revision.
Shaded cells in this table indicate older device revisions that are no longer in production.
SILICON ISSUE SUMMARY
CCP1CON
Full-Bridge
mode
SPI Clock
Slew Rate
Offset
Receiving
Master mode
SPI Master
SPI Master
SPI Master
Synchronous
Master mode
Synchronous
Master mode
Synchronous
Master mode
FVR
EC mode
Interrupt-on-
Change
Endurance
Endurance
CONFIG3H
Feature
—
—
—
—
—
—
Number
Item
10.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
11.
1.
2.
4.
5.
6.
7.
3.
8.
9.
Changing CCP1M bits may
cause capture of Timer1 value.
Direction change issue.
Shortened SPI high time.
Slow slew rate when
SLRCON<2> is set.
Time dependent on offset.
Address may be received as
data.
Master mode not functional.
Improper sampling of last bit.
SSPBUF improperly reloads on
SS pin transitions.
Improper extra pulse on SCK
pin.
Duty cycle of CK output is
skewed when SPBRG is odd.
LS bit corruption during
transmission when SPBRG = 3.
Clock fails to stop at end of
character transmission when
SPBRG = 0.
FVRST bit activates prematurely. X
IVRST bit activates prematurely.
Unexpected BOR occurrence.
HFINTOSC output accuracy.
Unexpected code execution at
low V
Premature POR release.
POR may become stuck.
48 MHz maximum frequency.
Presetting interrupt-on-change
issue.
Endurance is limited to 10K
cycles.
Endurance is limited to 1K
cycles.
HFOFST bit erases to ‘0’ instead
of ‘1’.
DD
Issue Summary
.
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
 2010 Microchip Technology Inc.
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Affected Revisions
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
(1)
X
X