PIC16F886-I/SS Microchip Technology, PIC16F886-I/SS Datasheet - Page 272

• Manufacturer Part Number: PIC16F886-I/SS
• Description: IC PIC MCU FLASH 8KX14 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F886-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 28-SSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: MSSP/EUSART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM164123 - KIT MANAGEMENT SYSTEM PICDEMAC164307 - MODULE SKT FOR PM3 28SSOPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F882/883/884/886/887
DS41291D-page 270
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
Preliminary
E
EXPOSED
A
NOTE 1
Units
A1
E2
D2
A3
N
A
E
D
K
e
b
L
PAD
E2
1
2
0.80
0.00
6.30
6.30
0.25
0.30
0.20
MIN
N
MILLIMETERS
0.65 BSC
0.20 REF
8.00 BSC
8.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
–
Microchip Technology Drawing C04-103B
D2
© 2007 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
0.38
0.50
6.80
–
K
e
b