MC33274AD ON Semiconductor, MC33274AD Datasheet
MC33274AD
Specifications of MC33274AD
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MC33274AD Summary of contents
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... PDIP−8 P SUFFIX CASE 626 8 1 SOIC− SUFFIX CASE 751 for MC33272AD/DR2 = N for NCV33272ADR2 QUAD PDIP−14 P SUFFIX CASE 646 MC33274ADG AWLYWW MC33 274A ALYWG Assembly Location WL Wafer Lot YY Year WW Work Week Pb−Free Package (Note: Microdot may be in either location) ...
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DUAL CASE 626/751 Output Inputs (Top View) MAXIMUM RATINGS Rating Supply Voltage Input Differential Voltage Range Input Voltage Range Output Short Circuit Duration (Note 2) Maximum Junction Temperature Storage Temperature ...
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DC ELECTRICAL CHARACTERISTICS Characteristics Input Offset Voltage ( + − +25° −40° to +85° ...
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AC ELECTRICAL CHARACTERISTICS Characteristics Slew Rate (V = − + 2.0 kW Gain Bandwidth Product (f = 100 kHz) AC Voltage Gain (R = 2.0 kW ...
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MC33272P & MC33274P 1600 MC33274D 1200 800 MC33272D 400 0 -60 -40 - 100 120 140 160 180 T , AMBIENT TEMPERATURE (°C) A Figure 2. Maximum Power Dissipation versus Temperature 400 350 ...
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T = 25° 5 SUPPLY VOLTAGE ( Figure 8. Split Supply Output Voltage Swing versus Supply Voltage 125°C ...
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T = 125°C A 100 +PSR = 20Log 100 1 FREQUENCY (Hz) Figure ...
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Gain 15 10 Phase 5 - 25°C A -20 -25 100 k 1 FREQUENCY ...
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Phase Margin 9 + - 25° ...
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+ - +1 2 100 pF L ...
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... MC33272ADR2 MC33272ADR2G MC33272AP MC33272APG NCV33272ADR2* NCV33272ADR2G* MC33274AD MC33274ADG MC33274ADR2 MC33274ADR2G MC33274ADTBR2G MC33274AP MC33274APG NCV33274AD* NCV33274ADG* NCV33274ADR2* NCV33274ADR2G* NCV33274ADTBR2G* †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV prefix for automotive and other applications requiring site and control changes. ...
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... G C SEATING PLANE −Z− 0.25 (0.010 0.024 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...
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−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE http://onsemi.com 13 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI ...
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... IDENT. 1 0.15 (0.006 −V− C 0.10 (0.004) −T− G SEATING D PLANE 14X 0.36 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. TSSOP−14 CASE 948G−01 ISSUE 0.25 (0.010 − ...
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... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...