IRL530NS International Rectifier, IRL530NS Datasheet

MOSFET N-CH 100V 17A D2PAK

IRL530NS

Manufacturer Part Number
IRL530NS
Description
MOSFET N-CH 100V 17A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRL530NS

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
100 mOhm @ 9A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
17A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
34nC @ 5V
Input Capacitance (ciss) @ Vds
800pF @ 25V
Power - Max
3.8W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRL530NS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRL530NS/S
Manufacturer:
IR
Quantity:
12 500
Part Number:
IRL530NSTRLPBF
Manufacturer:
GROUP-TEK
Quantity:
2 000
Description
Thermal Resistance
Absolute Maximum Ratings
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRL530NL) is available for low-
profile applications.
R
R
I
I
I
P
P
V
E
I
E
dv/dt
T
T
D
D
DM
AR
2
J
STG
D
D
GS
AS
AR
Pak is suitable for high current applications because of
@ T
@ T
JC
JA
@T
@T
Advanced Process Technology
Surface Mount (IRL530NS)
Low-profile through-hole (IRL530NL)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
2
Pak is a surface mount power package capable of
C
C
A
C
= 25°C
= 100°C
= 25°C
= 25°C
on-resistance per silicon area.
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Parameter
Parameter
GS
GS
@ 10V
@ 10V
This
G 11
Typ.
300 (1.6mm from case )
–––
–––
D P ak
HEXFET
2
-55 to + 175
IRL530NS/L
D
S
Max.
0.53
± 20
150
3.8
9.0
7.9
5.0
17
12
60
79
®
R
T O -26 2
Power MOSFET
DS(on)
Max.
V
1.9
40
DSS
I
D
= 17A
PD - 91349C
=100V
= 0.10
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
W
W
°C
A
V
A
1/09/04

Related parts for IRL530NS

IRL530NS Summary of contents

Page 1

... Advanced Process Technology Surface Mount (IRL530NS) Low-profile through-hole (IRL530NL) 175°C Operating Temperature Fast Switching Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. benefit, combined with the fast switching speed and ...

Page 2

... IRL530NS/L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Fig 3. Typical Transfer Characteristics TOP BOTTOM 2. 0 0.1 V Fig 2. Typical Output Characteristics 3 2.5 2.0 1.5 1.0 0.5 0.0 A -60 -40 - unc tion T em perature (° Fig 4. Normalized On-Resistance IRL530NS/L VGS 15V 12V 10V 8.0V 6.0V 4.0V 3.0V 2 0µ ° rain-to-S ource V oltage ( Vs. Temperature A A ...

Page 4

... IRL530NS iss iss oss rss rain-to-S ourc e V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 5° 5° 0.4 0.6 0.8 1 ourc e-to-D rain V oltage ( Fig 7. Typical Source-Drain Diode Forward Voltage ing lse 1.2 1.4 Fig 8. Maximum Safe Operating Area = 9 FIG otal G ate C harge ( Fig 6 ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case R G Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 0. Rectangular Pulse Duration (sec) 1 IRL530NS D.U. 5.0V µ d(off ...

Page 6

... IRL530NS D.U. 5 0.01 Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform (BR)DSS tarting unc tion T em perature (° Fig 12c. Maximum Avalanche Energy Same Type as D.U.T. 12V V GS Fig 13b. Gate Charge Test Circuit ...

Page 7

... Current Current D.U.T. V Waveform DS Diode Recovery Re-Applied Voltage Body Diode Inductor Curent Ripple for Logic Level Devices GS Fig 14. For N-Channel HEXFETS IRL530NS/L Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + + controlled by Duty Factor "D" P. Period V =10V ...

Page 8

UCDTÃDTÃ6IÃDSA$"TÃXDUC GPUÃ8P9 Ã'!# 6TT H7G 9ÃPIÃXXÃ!Ã! DIÃUC Ã6TT H7G`ÃGDI ÃÅGÅ For GB Production UCDTÃDTÃ6IÃDSA$"TÃXDUC GPUÃ8P9 Ã'!# 6TT H7G 9ÃPIÃXXÃ!Ã! DIÃUC Ã6TT H7G`ÃGDI ÃÅGÅ Q6SUÃIVH7 S DIU SI6UDPI6G S 8UDAD S A$"T GPBP 96U Ã8P9 ` 6SÃÃ2Ã! 6TT H7G` ...

Page 9

TO-262 Package Outline TO-262 Part Marking Information IGBT 1- GATE 2- COLLEC- TOR ...

Page 10

Dimensions are shown in millimeters (inches) FEED DIRECTION FEED DIRECTION NOTES : 1. COMFORMS TO EIA-418. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION MEASURED @ HUB. 4. INCLUDES FLANGE DISTORTION @ OUTER EDGE. IR WORLD HEADQUARTERS: 233 Kansas St., El ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

Related keywords