CKG45NX5R1H106M TDK Corporation, CKG45NX5R1H106M Datasheet - Page 13

CAP CER 10UF 50V X5R 20% SMD

CKG45NX5R1H106M

Manufacturer Part Number
CKG45NX5R1H106M
Description
CAP CER 10UF 50V X5R 20% SMD
Manufacturer
TDK Corporation
Series
CKGr
Datasheets

Specifications of CKG45NX5R1H106M

Capacitance
10µF
Tolerance
±20%
Voltage - Rated
50V
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Features
Stacked
Applications
Automotive
Package / Case
Non-Standard SMD
Size / Dimension
0.217" L x 0.158" W (5.50mm x 4.00mm)
Thickness
5.50mm Max
Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 85 C
Temperature Coefficient / Code
X5R
Product
Low ESR MLCCs
Dimensions
4 mm W x 5.5 mm L x 5.5 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-1660-2
CKG45NX5R1H106MT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CKG45NX5R1H106M500JH
Manufacturer:
TDK
Quantity:
20 000
Part Number:
CKG45NX5R1H106MT
Manufacturer:
TDK
Quantity:
20 000
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
A
B
C
Type
Soldering
Information
C
B
CKG32K
2.0 ~ 2.2
1.1 ~ 1.3
2.3 ~ 2.5
Chip capacitor
A
CKG45K
CKG45N
3.3 ~ 3.7
1.2 ~ 1.5
2.7 ~ 3.2
Solder land
CKG57K
CKG57N
3.9 ~ 4.3
1.5 ~ 2.0
4.5 ~ 5.0
Unit: mm
Solder resist
CKG Series — Mega Cap Type Capacitors
Maximum amount
Minimum amount
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Peak
Temp
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Over 60 sec.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
∆T
Soldering
Preheating
Method
Reflow Soldering
US Catalog // CKG Series — Mega Cap Type // Version A11
Temp./
Peak Temp time
Dura.
Soldering Natural
cooling
Peak temp
230 max.
250 max.
(°C)
Temperature (ºC)
Reflow Soldering
300
∆T ≤ 130
∆T ≤ 130
0
Duration
20 max.
10 max.
∆T
(sec.)
Manual soldering
Preheating
(Solder iron)
3sec. (As short as possible)

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