AD9236BRU-80EB Analog Devices Inc, AD9236BRU-80EB Datasheet - Page 34
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AD9236BRU-80EB
Manufacturer Part Number
AD9236BRU-80EB
Description
BOARD EVAL FOR AD9236-80 TSSOP
Manufacturer
Analog Devices Inc
Datasheet
1.AD9236BCPZRL7-80.pdf
(36 pages)
Specifications of AD9236BRU-80EB
Rohs Status
RoHS non-compliant
Number Of Adc's
1
Number Of Bits
12
Sampling Rate (per Second)
80M
Data Interface
Parallel
Inputs Per Adc
1 Differential
Input Range
2 Vpp
Power (typ) @ Conditions
366mW @ 80MSPS
Voltage Supply Source
Single
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9236-80
Lead Free Status / Rohs Status
Not Compliant
AD9236
ORDERING GUIDE
Model
AD9236BRU-80
AD9236BRURL7-80
AD9236BRUZ-80
AD9236BRUZRL7-80
AD9236BCP-80
AD9236BCPRL7-80
AD9236BCPZ-80
AD9236BCPZRL7-80
AD9236BRU-80EB
AD9236BCP-80EB
1
2
Z = Pb-free part.
It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP. There is an increased reliability of the solder joints, and the maximum
thermal capability of the package is achieved with the exposed paddle soldered to the customer board.
2
1, 2
1
2
2
1, 2
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
32-Lead Lead Frame Chip Scale (LFCSP_VQ)
32-Lead Lead Frame Chip Scale (LFCSP_VQ)
32-Lead Lead Frame Chip Scale (LFCSP_VQ)
32-Lead Lead Frame Chip Scale (LFCSP_VQ)
TSSOP Evaluation Board
LFCSP Evaluation Board
Rev. B | Page 34 of 36
Package Option
RU-28
RU-28
RU-28
RU-28
CP-32-2
CP-32-2
CP-32-2
CP-32-2