OM6290 NXP Semiconductors, OM6290 Datasheet - Page 40

• Manufacturer Part Number: OM6290
• Description: DEMO BOARD LCD GRAPHIC DRIVER
• Manufacturer: NXP Semiconductors

Specifications of OM6290

• Main Purpose: Displays, LCD Controller
• Embedded: Yes, MCU, 16/32-Bit
• Utilized Ic / Part: PCF2119, PCF8531, PCF8576
• Primary Attributes: Character, Graphic and Segment LCD Drivers
• Secondary Attributes: JTAG, I²C, UART & USB Interfaces
• Description/function: Demo Board
• Interface Type: USB, I2C, JTAG, UART
• Data Bus Width: 4 bit, 8 bit, 16 bit
• Operating Voltage: 1.8 V to 5.5 V
• For Use With/related Products: PCF8576DT, PCF2119S, PCF8531
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4703

Philips Semiconductors
17.5
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2001 Oct 02
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Universal LCD driver for low multiplex rates
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
PACKAGE
40
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(2)
SOLDERING METHOD
(3)(4)
(5)
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
PCF8576
(1)