OM6290 NXP Semiconductors, OM6290 Datasheet - Page 40
![DEMO BOARD LCD GRAPHIC DRIVER](/photos/9/4/90479/om6290_sml.jpg)
OM6290
Manufacturer Part Number
OM6290
Description
DEMO BOARD LCD GRAPHIC DRIVER
Manufacturer
NXP Semiconductors
Datasheets
1.PCF8576T1118.pdf
(44 pages)
2.OM6290.pdf
(30 pages)
3.OM6290.pdf
(51 pages)
4.OM6290.pdf
(83 pages)
Specifications of OM6290
Main Purpose
Displays, LCD Controller
Embedded
Yes, MCU, 16/32-Bit
Utilized Ic / Part
PCF2119, PCF8531, PCF8576
Primary Attributes
Character, Graphic and Segment LCD Drivers
Secondary Attributes
JTAG, I²C, UART & USB Interfaces
Description/function
Demo Board
Interface Type
USB, I2C, JTAG, UART
Data Bus Width
4 bit, 8 bit, 16 bit
Operating Voltage
1.8 V to 5.5 V
For Use With/related Products
PCF8576DT, PCF2119S, PCF8531
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4703
Philips Semiconductors
17.5
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2001 Oct 02
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Universal LCD driver for low multiplex rates
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
PACKAGE
40
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(2)
SOLDERING METHOD
(3)(4)
(5)
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
PCF8576
(1)