ATA006A0X4 Lineage Power, ATA006A0X4 Datasheet - Page 16

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ATA006A0X4

Manufacturer Part Number
ATA006A0X4
Description
CONVERT DC/DC 0.75 5.5V @ 6A SIP
Manufacturer
Lineage Power
Series
Austin MicroLynx™ IIr
Type
Point of Load (POL) Non-Isolated with Remote On/Offr
Datasheet

Specifications of ATA006A0X4

Rohs Status
RoHS non-compliant
Output
0.75 ~ 5.5V
Number Of Outputs
1
Power (watts)
33W
Mounting Type
Through Hole
Voltage - Input
8.3 ~ 14V
Package / Case
6-SIP Module
1st Output
0.75 ~ 5.5 VDC @ 6A
Size / Dimension
1.00" L x 0.26" W x 0.50" H (25.4mm x 6.7mm x 12.7mm)
Power (watts) - Rated
33W
Operating Temperature
-40°C ~ 85°C
Efficiency
89%
Approvals
CSA, EN, UL, VDE
3rd Output
-
2nd Output
-
Other names
555-1023

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATA006A0X4-SR
Manufacturer:
PULSE
Quantity:
643
Part Number:
ATA006A0X4-SR
Manufacturer:
TYCO
Quantity:
20 000
Part Number:
ATA006A0X4Z
Manufacturer:
GE
Quantity:
20 000
TM
Data Sheet
Austin MicroLynx II
12V SIP Non-isolated Power Modules:
January 18, 2010
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
technical representative for more details.
LINEAGE
POWER
16

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