JW150A1 Lineage Power, JW150A1 Datasheet - Page 16
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JW150A1
Manufacturer Part Number
JW150A1
Description
CONVERTER DC/DC 5V 150W OUT
Manufacturer
Lineage Power
Series
JW150r
Type
Isolated with Remote On/Offr
Datasheet
1.JW050A.pdf
(20 pages)
Specifications of JW150A1
Output
5V
Number Of Outputs
1
Power (watts)
150W
Mounting Type
Through Hole
Voltage - Input
36 ~ 75V
Package / Case
9-DIP Module
1st Output
5 VDC @ 30A
Size / Dimension
2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
Power (watts) - Rated
150W
Operating Temperature
-40°C ~ 100°C
Efficiency
84%
Approvals
CE, CSA, UL, VDE
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
3rd Output
-
2nd Output
-
4th Output
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Part Number:
JW150A1
Manufacturer:
LUCENT
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Part Number:
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Part Number:
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Company:
Part Number:
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Manufacturer:
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Quantity:
560
JW050A, JW075A, JW100A, JW150A Power Modules:
dc-dc Converters; 36 to 75 Vdc Input, 5 Vdc Output; 50 W to 150 W
Thermal Considerations
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink ( cs) and
sink-to-ambient ( sa) shown below (Figure 33).
Figure 33. Resistance from Case-to-Sink and
For a managed interface using thermal grease or foils,
a value of cs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation provides
a conservative estimate for such instances.
16
16
sa
P
=
D
Sink-to-Ambient
------------------------ -
T
C
P
T
–
D
C
T
A
–
cs
cs
T
S
(continued)
sa
T
A
8-1304 (C)
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the Board-Mounted Power
Modules Soldering and Cleaning Application Note
(AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS98-152EPS).
Data Sheet
April 2008
Lineage Power