HLMP-NM30-H0000 Avago Technologies US Inc., HLMP-NM30-H0000 Datasheet - Page 7

• Manufacturer Part Number: HLMP-NM30-H0000
• Description: LED 3MM INGAN 525NM GREEN
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-NM30-H0000

• Color: Green
• Luminous Flux @ Current - Test: 214 mlm
• Millicandela Rating: 1000mcd
• Current - Test: 20mA
• Wavelength - Dominant: 527nm
• Wavelength - Peak: 520nm
• Voltage - Forward (vf) Typ: 3.8V
• Lens Type: Clear
• Lens Style/size: Round, 3mm, T-1
• Package / Case: Radial - 2 Lead
• Height: 5.85mm
• Viewing Angle: 30°
• Mounting Type: Through Hole
• Resistance Tolerance: 527nm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
7
Example of Wave Soldering Temperature Profile for TH LED
250
200
150
100
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
(1P) Item: Part Number
(V) Vendor ID:
50
0
10
20
PREHEAT
30
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
max temp 250C
70
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.