PC929 Sharp Microelectronics, PC929 Datasheet - Page 18

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PC929

Manufacturer Part Number
PC929
Description
PHOTOCOUPLER OPIC 14-SMD
Manufacturer
Sharp Microelectronics
Series
OPIC™r
Datasheet

Specifications of PC929

Voltage - Isolation
4000Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
100mA
Propagation Delay High - Low @ If
300ns @ 5mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Package / Case
14-SMD
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
425-1544-5

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■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
18
3
Reflow
220˚C or more, 60s or less
4
(min)
Sheet No.: D2-A06301EN
PC929 Series

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