5962-9085401HXA Avago Technologies US Inc., 5962-9085401HXA Datasheet - Page 4

• Manufacturer Part Number: 5962-9085401HXA
• Description: OPTOCOUPLER HERMETIC 8-DIP GW
• Manufacturer: Avago Technologies US Inc.

Specifications of 5962-9085401HXA

• Input Type: DC
• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 1500VDC
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 8mA
• Data Rate: 700kBd
• Propagation Delay High - Low @ If: 400ns @ 16mA
• Current - Dc Forward (if): 20mA
• Output Type: Open Collector
• Mounting Type: Surface Mount, Gull Wing
• Output Device: Phototransistor
• Configuration: 1 Channel
• Current Transfer Ratio: 20 %
• Maximum Baud Rate: 400 KBps
• Maximum Forward Diode Voltage: 1.9 V
• Maximum Input Diode Current: 20 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

8 Pin Ceramic DIP Single Channel Schematic
CATHODE
Note, base is pin 7.
Functional Diagrams
Note: 8 pin DIP and flat pack devices have common V
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
4
0.51 (0.020)
ANODE
MIN.
channels with separate V
1


4
5
6
7
8
Through Hole
 Channels
16 Pin DIP
V
F
+
2
-
3
I
F
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
V
V
GND
GND
V
CC1
V
V
CC
V
B1
O1
B
O
0.89 (0.035)
1.65 (0.065)
16
15
14
1
1
11
10
9
2.29 (0.090)
2.79 (0.110)
CC
and ground connections.
1


4
20.06 (0.790)
20.83 (0.820)
Through Hole
1 Channel
8 Pin DIP
I
I
I
CC
B
O
5
8
7
6
V
V
V
GND
V
CC
B
O
GND
V
OUT
CC
V
B
CC
0.51 (0.020)
8
7
6
5
and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated
MAX.
1


4
3.81 (0.150)
Through Hole
 Channels
8 Pin DIP
MIN.
4.45 (0.175)
MAX.
GND
V
V
V
CC
O1
O
8
7
6
5
8.13 (0.320)
16 Pin Flat Pack
Unformed Leads
1


4
5
6
7
8
0.20 (0.008)
0.33 (0.013)
MAX.
4 Channels
GND
V
V
V
V
V
CC
O1
O
O
O4
16
15
14
1
1
11
10
9
19
0


Surface Mount
0 Pad LCCC
 Channels
GND
V
1
CC
15
V
7
O1
14
GND
V
8
V
V
CC1
V
B
O
B1

1
1
10
9