5962-9085401HXA Avago Technologies US Inc., 5962-9085401HXA Datasheet - Page 2

OPTOCOUPLER HERMETIC 8-DIP GW

5962-9085401HXA

Manufacturer Part Number
5962-9085401HXA
Description
OPTOCOUPLER HERMETIC 8-DIP GW
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of 5962-9085401HXA

Input Type
DC
Package / Case
8-SMD Gull Wing
Voltage - Isolation
1500VDC
Number Of Channels
1, Unidirectional
Current - Output / Channel
8mA
Data Rate
700kBd
Propagation Delay High - Low @ If
400ns @ 16mA
Current - Dc Forward (if)
20mA
Output Type
Open Collector
Mounting Type
Surface Mount, Gull Wing
Output Device
Phototransistor
Configuration
1 Channel
Current Transfer Ratio
20 %
Maximum Baud Rate
400 KBps
Maximum Forward Diode Voltage
1.9 V
Maximum Input Diode Current
20 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Each channel contains a GaAsP light emitting diode which
is optically coupled to an integrated photon detector.
Separate connections for the photodiodes and output
transistor collectors improve the speed up to a hundred
times that of a conventional phototransistor optocoupler
by reducing the base-collector capacitance.
These devices are suitable for wide bandwidth analog
applications, as well as for interfacing TTL to LSTTL or
CMOS. Current Transfer Ratio (CTR) is 9% minimum at I
= 16 mA. The 18 V V
to interface any TTL family to CMOS. The availability of
the base lead allows optimized gain/ bandwidth adjust-
ment in analog applications. The shallow depth of the
IC photodiode provides better radiation immunity than
conventional phototransistor couplers.
These products are also available with the transistor base
node not connected to improve common mode noise
immunity and ESD susceptibility. In addition, higher CTR
minimums are available by special request.
Package styles for these parts are 8 and 16 pin DIP through
hole (case outlines P and E respectively), 16 pin DIP flat
pack (case outline F), and leadless ceramic chip carrier
(case outline 2). Devices may be purchased with a variety
of lead bend and plating options, see Selection Guide Table
for details. Standard Microcircuit Drawing (SMD) parts are
available for each package and lead style.
Because the same functional die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and perfor-
mance characteristics shown in the figures are identical
for all parts. Occasional exceptions exist due to package
variations and limitations and are as noted. Additionally,
the same package assembly processes and materials are
used in all devices. These similarities give justification for
the use of data obtained from one part to represent other
part’s performance for die related reliability and certain
limited radiation test results.

CC
capability will enable the designer
F
Truth Table
(Positive Logic)
Functional Diagram
Multiple Channel Devices Available
On (H)
Off (L)
Input
GND
V
Output
V
CC
V
B
O
H
L

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