HCPL-M611-500E Avago Technologies US Inc., HCPL-M611-500E Datasheet - Page 5
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HCPL-M611-500E
Manufacturer Part Number
HCPL-M611-500E
Description
OPTOCOUPLER 10MBD LOGIC SO-5
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-M611-000E.pdf
(11 pages)
Specifications of HCPL-M611-500E
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
25ns @ 7.5mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount
Package / Case
5-SOP
No. Of Channels
1
Optocoupler Output Type
Logic Gate
Input Current
15mA
Output Voltage
5.5V
Opto Case Style
SOIC
No. Of Pins
5
Input Current Max
15mA
Isolation Voltage
3.75kV
Number Of Elements
1
Baud Rate
10Mbps
Forward Voltage
1.75V
Forward Current
20mA
Output Current
50mA
Package Type
SOIC
Operating Temp Range
-40C to 85C
Power Dissipation
85mW
Propagation Delay Time
75ns
Pin Count
5
Mounting
Surface Mount
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-M611-500E
Manufacturer:
AVAGO
Quantity:
45 000
Part Number:
HCPL-M611-500E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
Absolute Maximum Ratings
(No Derating Required up to 85°C)
5
Parameter
Storage Temperature
Operating Temperature
Forward Input Current - I
Reverse Input Voltage - V
Supply Voltage - V
Output Collector Current - I
Output Collector Power Dissipation
Output Collector Voltage - V
Infrared and Vapor Phase Reflow Temperature
TEMPERATURE
(Selection for higher output voltages up to 20 V is available)
ROOM
T
T
smax
smin
300
200
100
T
T
25
CC
p
L
0
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
(1 Minute Maximum)
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
F
R
(see Note 2)
O
O
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
PREHEAT
RAMP-UP
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
Abs. Max.
-55°C to +125°C
-40°C to +85°C
20 mA
5 V
7 V
50 mA
85 mW
7 V
see below
150
SEC.
SEC.
30
30
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
smax
50 SEC.
SOLDERING
= 200 °C, T
200°C
TIME
200
PEAK
TEMP.
240°C
smin
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
= 150 °C
250