IDT72T55268L6-7BBI IDT, Integrated Device Technology Inc, IDT72T55268L6-7BBI Datasheet - Page 16
IDT72T55268L6-7BBI
Manufacturer Part Number
IDT72T55268L6-7BBI
Description
IC CTRL QUADMUX FLOW 324-BGA
Manufacturer
IDT, Integrated Device Technology Inc
Datasheet
1.IDT72T55248L6-7BB.pdf
(65 pages)
Specifications of IDT72T55268L6-7BBI
Configuration
Dual
Density
4.5Mb
Access Time (max)
3.7ns
Word Size
36b
Sync/async
Synchronous
Expandable
Yes
Bus Direction
Uni-Directional
Package Type
BGA
Clock Freq (max)
166MHz
Operating Supply Voltage (typ)
2.5V
Operating Supply Voltage (min)
2.375V
Operating Supply Voltage (max)
2.625V
Supply Current
150mA
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
72T55268L6-7BBI
NOTES:
1. Both WCLK and RCLK toggling at 20MHz.
2. Data inputs toggling at 10MHz.
3. Typical I
4. Typical I
5. Total Power consumed: PT = [(V
6. Maximum value tested wtih RCLK = WCLK = 20MHz at 85°C. Maximum value may differ depending on V
7. Outputs are not 3.3V tolerant.
8. V
9. V
10. V
11. V
12. V
13. V
DC ELECTRICAL CHARACTERISTICS
(Industrial: V
IDT72T55248/72T55258/72T55268 2.5V QuadMux DDR Flow-Control Device with
Mux/Demux/Broadcast functions 8K x 40 x 4, 16K x 40 x 4 and 32K x 40 x 4
Symbol
I
I
V
V
I
I
I
I
I
I
LI
LO
CC1
DDQ
SB1
SB2
PD1
PD2
OH
OL
CC
CC
CC
CC
CC
CC
(1,2,3)
(1,2,3)
(7)
(1,2,3)
(1,2,3)
(1,2,3)
(1,2,3)
= 2.5V, WCLK0-3 = RCLK0 = 20MHz, WEN0-3 = REN0 = LOW, WCS0-3 = RCS0 = LOW, OE = LOW, PD = HIGH.
= 2.5V, WCLK0-3 = RCLK0 = 20MHz, WEN0-3 = REN0 = HIGH, WCS0-3 = RCS0 = HIGH, OE = LOW, PD = HIGH.
= 2.5V, WCLK0 = RCLK0-3 = 20MHz, WEN0 = REN0-3 = HIGH, WCS0 = RCS0-3 = HIGH, OE0-3 = LOW, PD = HIGH.
= 2.5V, WCLK0-3 = RCLK0 = 20MHz, WEN0-3 = REN0 = HIGH, WCS0-3 = RCS0 = HIGH, OE = LOW, PD = LOW.
= 2.5V, WCLK0 = RCLK0-3 = 20MHz, WEN0 = REN0-3 = HIGH, WCS0 = RCS0-3 = HIGH, OE0-3 = LOW, PD = LOW.
= 2.5V, WCLK0 = RCLK0-3 = 20MHz, WEN0 = REN0-3 = LOW, WCS0 = RCS0-3 = LOW, OE0-3 = LOW, PD = HIGH.
CC1
DDQ
CC
Input Leakage Current
Output Leakage Current
Output Logic “1” Voltage,
Output Logic “0” Voltage,
Active V
(See Note 8 and 9 for test conditions)
Active V
(See Note 8 and 9 for test conditions)
Standby V
(See Note 10 and 11 for test conditions)
Standby V
(See Note 10 and 11 for test conditions)
Power Down V
(See Note 12 and 13 for test conditions)
Power Down V
(See Note 12 and 13 for test conditions)
calculation
calculation: With Data Outputs in High-Impedance: I
= 2.5V ± 0.125V, T
DDQ
CC
:
DDQ
CC
Current
for LVTTL I/O I
for HSTL or eHSTL I/O I
With Data Outputs in Low-Impedance: I
fs = WCLK frequency = RCLK frequency (in MHz), V
t
Current
A
Current (Mux mode)
Current
DDQ
= 25°C, C
CC
Current (Mux mode)
CC
Current
x I
A
L
CC
= -40°C to +85°C)
CC1
= capacitive load (pF), N = Number of bits switching
) + (V
(mA) = 10 x f
Parameter
DDQ
CC1
x I
(mA) = 72+ (10 x f
DDQ
S
)]. I
, f
S
OH
DDQ
DDQ
= WCLK frequency = RCLK frequency (in MHz)
= -8mA for all voltage levels.
(mA) =
(mA) = C
I
I
I
I
I
I
-- LVTTL
-- eHSTL
-- HSTL
-- LVTTL
-- eHSTL
-- HSTL
-- LVTTL
-- eHSTL
-- HSTL
-- LVTTL
-- eHSTL
-- HSTL
-- LVTTL
-- eHSTL
-- HSTL
-- LVTTL
-- eHSTL
-- HSTL
OH
OH
OH
OL
OL
OL
S
= 8 mA @LVTTL
= –8 mA @LVTTL
= 8 mA @eHSTL
= 8 mA @HSTL
= –8 mA @eHSTL
= –8 mA @HSTL
), f
0.78 x f
S
L
DDQ
= WCLK frequency = RCLK frequency (in MHz)
x V
16
= 2.5V for LVTTL; 1.5V for HSTL; 1.8V for eHSTL
DDQ
S
x f
S
x N /2000
V
V
V
CC
DDQ
DDQ
DDQ
Min.
–10
–10
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
and temperature.
-0.4
-0.4
-0.4
240
330
330
110
190
190
Max.
+10
+10
15
30
30
0.4
0.4
0.4
0.5
0.5
0.5
COMMERCIAL AND INDUSTRIAL
—
—
—
50
30
30
40
30
30
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
TEMPERATURE RANGES
FEBRUARY 01, 2009
Unit
µA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
µA
V
V
V
V
V
V