MAX8805XEWEAA+T Maxim Integrated Products, MAX8805XEWEAA+T Datasheet - Page 2

• Manufacturer Part Number: MAX8805XEWEAA+T
• Description: IC PWM STEP-DN CONV 650MA 16-WLP
• Manufacturer: Maxim Integrated Products

Specifications of MAX8805XEWEAA+T

• Applications: Converter, WCDMA PA Power
• Voltage - Input: 2.7 ~ 5.5 V
• Number Of Outputs: 1
• Voltage - Output: 0.4 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-WLP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
IN1A, IN1B, IN2, REFIN, EN2, REFBP to AGND ...-0.3V to +6.0V
PAA, PAB, PA_EN, HP to AGND....-0.3V to (V
LDO1, LDO2, EN1 to AGND ......................-0.3V to (V
IN2 to IN1B/IN1A ...................................................-0.3V to +0.3V
PGND to AGND .....................................................-0.3V to +0.3V
LX Current ......................................................................0.7A
IN1A/IN1B and PAA/PAB Current .....................................2A
600mA/650mA PWM Step-Down Converters in
2mm x 2mm WLP for WCDMA PA Power
Note: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
(MAX8805W/MAX8805X), T
2
INPUT SUPPLY
Input Voltage
Input Undervoltage Threshold
Shutdown Supply Current
No-Load Supply Current
THERMAL PROTECTION
Thermal Shutdown
LOGIC CONTROL
PA_EN, EN1, EN2, HP Logic-
Input High Voltage
PA_EN, EN1, EN2, HP Logic-
Input Low Voltage
Logic-Input Current
(PA_EN, EN1, EN2, HP)
REFIN
REFIN Common-Mode Range
REFIN to PA_ Gain
REFIN Input Resistance
IN1A
_______________________________________________________________________________________
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
= V
PARAMETER
IN1B
= V
IN2
= V
A
PA_EN
= -40°C to +85°C. Typical values are at T
= V
V
V
V
V
V
switching
V
T
2.7V ≤ V
2.7V ≤ V
V
MAX8805Y/MAX8805Z
MAX8805W/MAX8805X
V
2.2V (I
V
1.32V, 1.76V (I
MAX8805Y/MAX8805Z
MAX8805W/MAX8805X
A
IN1A
IN1A
PA_EN
PA_EN
EN1
EN1
IL
REFIN
REFIN
EN1
rising, 20°C typical hysteresis
= 0V or V
= V
= V
, V
, V
LX
= 0.4V, 0.9V, 1.7V,
= 0.32V, 0.75V,
= V
= V
= 0V, I
IN1A
IN1B
IN1B
IN1A
IN1A
EN2
EN2
= 0mA)
EN1
EN2
/V
, V
, V
IH
= V
= V
= 0V, I
= 0V, V
IN1B
LDO1
LX
IN2
IN2
= V
IN2
= V
= 3.6V, V
IN1B
IN1B
= 0mA)
rising, 180mV typical hysteresis
IN1A
+ 0.3V)
+ 0.3V)
EN2
PA
= I
HP
= V
= V
CONDITIONS
RMS
RMS
LDO2
= 0mA,
= 0V
= 5.5V
= 3.6V
IN2
IN2
HP
= 0mA
≤ 5.5V
≤ 5.5V
MAX8805Y/MAX8805Z
MAX8805W/MAX8805X
= 0V, V
PAA and PAB Short Circuit to PGND or IN1_.............Continuous
Continuous Power Dissipation (T
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering, reflow) ............................+260°C
T
T
MAX8805W/MAX8805Y
MAX8805X/MAX8805Z
A
T
T
A
A
A
A
16-Bump UCSP (derate 12.5mW/°C above +70°C) ..........1W
16-Bump WLP (derate 12.5mW/°C above +70°C).............1W
=+25°C, unless otherwise noted.) (Note 1)
= +25°C
= +85°C
= +25°C
= +85°C
REFIN
= 0.9V (MAX8805Y/MAX8805Z), V
MIN
2.52
1.96
2.45
2.7
1.4
0.1
0.1
A
= +70°C)
+160
3500
5000
TYP
2.63
0.01
2.00
2.50
150
150
540
320
0.1
0.1
0.1
MAX
2.70
1.76
2.04
2.55
250
5.5
0.4
2.2
4
1
REFIN
= 0.72V
UNITS
V/V
kΩ
µA
µA
°C
µA
V
V
V
V
V