GNM314R72A681KD01D Murata Electronics North America, GNM314R72A681KD01D Datasheet - Page 76

• Manufacturer Part Number: GNM314R72A681KD01D
• Description: CAP 4-ARRAY 680PF 100V X7R 1206
• Manufacturer: Murata Electronics North America
• Series: GNMr

Specifications of GNM314R72A681KD01D

• Capacitance: 680pF
• Voltage - Rated: 100V
• Dielectric Material: Ceramic
• Number Of Capacitors: 4
• Circuit Type: Isolated
• Temperature Coefficient: X7R
• Tolerance: ±10%
• Mounting Type: Surface Mount
• Package / Case: 1206 (3216 Metric)
• Height: 0.031" (0.80mm)
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 490-3419-2

13
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
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No.
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12
13
14
15
16
Specifications and Test Methods
Continued from the preceding page.
Vibration
Resistance
Resistance
to Soldering Heat
Deflection
Solderability of
Termination
Temperature
Cycle
Humidity
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Q
No defects or abnormalities
Within the specified tolerance
Satisfies the initial value.
220pFFCV1,220pF : QU10,000
220pFFCV1,470pF : QU15,000
470pFFCV1,000pF : QU13,000
C: Nominal Capacitance (pF)
No crack or marked defect should occur.
95% of the terminations are to be soldered evenly and
continuously.
The measured and observed characteristics should satisfy the
specifications in the following table.
The measured and observed characteristics should satisfy the
specifications in the following table.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
Capacitance
Change
Q
Dielectric Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric Strength
Appearance
Capacitance
Change
Q
I.R.
R230
Capacitance meter
45
Item
Item
Item
20
Fig.3a
50
45
Pressurize
Pressurizing
speed : 1.0mm/sec.
Specifications
Flexure : V1
No marked defect
Within T2.5% or T0.25pF
(Whichever is larger)
220pFFCV1,220pF : QU10,000
220pFFCV1,470pF : QU15,000
470pFFCV1,000pF : QU13,000
No failure
No marked defect
Within T5% or T0.5pF
(Whichever is larger)
10pFVCU30pF : QU350
10pFVCF30pF : QU275W
10pFVCF10pF : QU200W10C
1,000MΩ min.
No failure
No marked defect
Within T5% or T0.5pF
(Whichever is larger)
10pFVCU30pF : QU350
10pFVCF30pF : QU275W
10pFVCF10pF : QU200W10C
1,000MΩ min.
C: Nominal Capacitance (pF)
C: Nominal Capacitance (pF)
C: Nominal Capacitance (pF)
Specifications
Specifications
Specifications
Fig. 2a
100
b
c
a
5
2
5
2
t : 1.6mm
C
C
ø4.5
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz,
should be traversed in approximately 1 minute. This motion
should be applied for a period of 2 hours in each of 3 mutually
perpendicular directions (total of 6 hours).
Solder the capacitor on the test jig (glass epoxy board) shown
in Fig. 2a using an eutectic solder. Then apply a force in the
direction shown in Fig. 3a. The soldering should be done by
the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
Immerse the capacitor in a solution of isopropyl alcohol and
rosin (25% rosin in weight proportion).
Preheat at 80 to 120D for 10 to 30 seconds.
After preheating, immerse in an eutectic solder
or Sn-3.0Ag-0.5Cu solder solution for 5±0.5 seconds
at 245±5D.
Preheat according to the conditions listed in the table below.
Immerse the capacitor in an eutectic solder or Sn-3.0Ag-0.5Cu
solder solution at 270±5D for 10±0.5 seconds. Let sit at room
temperature for 24±2 hours.
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10). Perform the five cycles
according to the four heat treatments listed in the following table.
Let sit for 24T2 hours at room temperature, then measure.
Apply the 24-hour heat (Y10 to W65D) and humidity (80 to 100%)
treatment shown below, 10 consecutive times. Remove, let sit for
24T2 hours at room temperature, and measure.
-10
70
65
60
55
50
45
40
35
30
25
20
15
10
Temp. (D)
Time (min.)
D
-5
2.0Z1.25mm max.
3.2Z2.5mm
5
0
Step
Chip Size
ERB18
ERB21
ERB32
Type
Initial measurement
0 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18 19 2021 22 23 24
Humidity
90-98%
Temp. W0/Y3
Operating
Applied voltage 50Vdc
30T3
Min.
1
Humidity
80-98%
Each 1 minute at 100 to 120D and then 170 to 200D
Test Method
+10
- 2 D
1.0
1.2
2.2
a
One cycle 24 hours
Humidity
1minute at 120 to 150D
5 max.
90-98%
Temp.
Room
Continued on the following page.
Preheat Condition
2
Hours
Humidity
80-98%
Temp. W3/Y0
3.0
4.0
5.0
Operating
b
30T3
Max.
3
Humidity90-98%
(in mm)
1.65
1.2
2.9
5 max.
Temp.
Room
c
4
C02E.pdf
07.2.6