LM5000SDX-6/NOPB National Semiconductor, LM5000SDX-6/NOPB Datasheet - Page 4

• Manufacturer Part Number: LM5000SDX-6/NOPB
• Description: IC REG SWITCHING HI VOLT 16-LLP
• Manufacturer: National Semiconductor
• Type: Step-Up (Boost), Flyback, Forward Converter, PWM - Current Moder

Specifications of LM5000SDX-6/NOPB

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: Adjustable
• Current - Output: 2A
• Frequency - Switching: 600kHz, 1.3MHz
• Voltage - Input: 3.1 ~ 40 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: *
• Package / Case: 16-LLP
• Voltage - Supply: 3.1 V ~ 40 V
• Frequency-max: 1.55MHz
• Duty Cycle: 90%
• Pwm Type: Current Mode
• Buck: No
• Boost: Yes
• Flyback: Yes
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: No
• For Use With: LM5000EVAL - EVALUATION BOARD FOR LM5000
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM5000SDX-6

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θ
JA
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended
to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, T
θ
dissipation at any ambient temperature is calculated using: P
excessive die temperature, and the regulator will go into thermal shutdown.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin.
Note 4: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%
production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
Note 5: Typical numbers are at 25°C and represent the most likely norm.
Note 6: Bias current flows into FB pin.
Note 7: Supply voltage, bias current product will result in aditional device power dissipation. This power may be significant. The thermal dissipation design should
take this into account.
Symbol
JA
, and the ambient temperature, T
Thermal Resistance
Parameter
A
. See the Electrical Characteristics table for the thermal resistance of various layouts. The maximum allowable power
TSSOP, Package only
LLP, Package only
D
(MAX) = (T
Conditions
J(MAX)
4
− T
A
)/θ
JA
. Exceeding the maximum allowable power dissipation will cause
(Note 4)
Min
J
(MAX), the junction-to-ambient thermal resistance,
(Note 5)
Typ
150
45
(Note 4)
Max
Units
°C/W