W9425G6EH-5 Winbond Electronics, W9425G6EH-5 Datasheet - Page 2

IC DDR-400 SDRAM 256MB 66TSSOPII

W9425G6EH-5

Manufacturer Part Number
W9425G6EH-5
Description
IC DDR-400 SDRAM 256MB 66TSSOPII
Manufacturer
Winbond Electronics
Datasheet

Specifications of W9425G6EH-5

Format - Memory
RAM
Memory Type
DDR SDRAM
Memory Size
256M (16Mx16)
Speed
250MHz
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
0°C ~ 70°C
Package / Case
66-TSOPII
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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8.
9.
10.
11.
OPERATION MODE ....................................................................................................................................18
8.1
8.2
8.3
8.4
ELECTRICAL CHARACTERISTICS ............................................................................................................24
9.1
9.2
9.3
9.4
9.5
9.6
9.7
SYSTEM CHARACTERISTICS FOR DDR SDRAM.....................................................................................31
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
TIMING WAVEFORMS ................................................................................................................................36
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10 Auto-precharge Timing (Write Cycle) ...............................................................................................44
7.10.3 CAS Latency field (A6 to A4)................................................................................................16
7.10.4 DLL Reset bit (A8) ................................................................................................................16
7.10.5 Mode Register /Extended Mode register change bits (BA0, BA1) ........................................16
7.10.6 Extended Mode Register field ..............................................................................................16
7.10.7 Reserved field ......................................................................................................................17
Simplified Truth Table ......................................................................................................................18
Function Truth Table ........................................................................................................................19
Function Truth Table for CKE...........................................................................................................22
Simplified Stated Diagram ................................................................................................................23
Absolute Maximum Ratings..............................................................................................................24
Recommended DC Operating Conditions ........................................................................................24
Capacitance .....................................................................................................................................25
Leakage and Output Buffer Characteristics......................................................................................25
DC Characteristics ...........................................................................................................................26
AC Characteristics and Operating Condition ....................................................................................27
AC Test Conditions ..........................................................................................................................28
Table 1: Input Slew Rate for DQ, DQS, and D M .............................................................................31
Table 2: Input Setup & Hold Time Derating for Slew Rate ...............................................................31
Table 3: Input/Output Setup & Hold Time Derating for Slew Rate....................................................31
Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate ....................................31
Table 5: Output Slew Rate Characteristics (X16 Devices only)........................................................31
Table 6: Output Slew Rate Matching Ratio Characteristics ..............................................................32
Table 7: AC Overshoot/Undershoot Specification for Address and Control Pins..............................32
Table 8: Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins...............................33
System Notes: ..................................................................................................................................34
Command Input Timing ....................................................................................................................36
Timing of the CLK Signals ................................................................................................................36
Read Timing (Burst Length = 4) .......................................................................................................37
Write Timing (Burst Length = 4) .......................................................................................................38
DM, DATA MASK (W9425G6EH).....................................................................................................39
Mode Register Set (MRS) Timing.....................................................................................................40
Extend Mode Register Set (EMRS) Timing ......................................................................................41
Auto-precharge Timing (Read Cycle, CL = 2) ..................................................................................42
Auto-precharge Timing (Read cycle, CL = 2), continued..................................................................43
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Publication Release Date:Dec. 03, 2008
W9425G6EH
Revision A08

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