CY7C1568V18-375BZXC Cypress Semiconductor Corp, CY7C1568V18-375BZXC Datasheet

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CY7C1568V18-375BZXC

Manufacturer Part Number
CY7C1568V18-375BZXC
Description
IC SRAM 72MBIT 375MHZ 165TFBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1568V18-375BZXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous, DDR II
Memory Size
72M (2M x 36)
Speed
375MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1568V18-375BZXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Features
Configurations
With Read Cycle Latency of 2.5 cycles:
CY7C1566V18 – 8M x 8
CY7C1577V18 – 8M x 9
CY7C1568V18 – 4M x 18
CY7C1570V18 – 2M x 36
Selection Guide
Note
Cypress Semiconductor Corporation
Document Number: 001-06551 Rev. *E
Maximum Operating Frequency
Maximum Operating Current
1. The QDR consortium specification for V
72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)
400 MHz clock for high bandwidth
2-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces
(data transferred at 800 MHz) at 400 MHz
Available in 2.5 clock cycle latency
Two input clocks (K and K) for precise DDR timing
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
Core V
HSTL inputs and variable drive HSTL output buffers
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
= 1.4V to V
SRAM uses rising edges only
DD
= 1.8V ± 0.1V; IO V
DD
.
Description
DDQ
DDQ
= 1.4V to V
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting V
DD
198 Champion Court
x18
x36
x8
x9
[1]
Architecture (2.5 Cycle Read Latency)
72-Mbit DDR-II+ SRAM 2-Word Burst
400 MHz
1400
1400
1400
1400
400
Functional Description
The CY7C1566V18, CY7C1577V18, CY7C1568V18, and
CY7C1570V18 are 1.8V Synchronous Pipelined SRAMs
equipped with DDR-II+ architecture. The DDR-II+ consists of an
SRAM core with advanced synchronous peripheral circuitry.
Addresses for read and write are latched on alternate rising
edges of the input (K) clock. Write data is registered on the rising
edges of both K and K. Read data is driven on the rising edges
of K and K. Each address location is associated with two 8-bit
words (CY7C1566V18), 9-bit words (CY7C1577V18), 18-bit
words (CY7C1568V18), or 36-bit words (CY7C1570V18) that
burst sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs, D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
375 MHz
1300
1300
1300
1300
375
San Jose
CY7C1566V18, CY7C1577V18
CY7C1568V18, CY7C1570V18
,
CA 95134-1709
333 MHz
1200
1200
1200
1200
333
Revised March 11, 2008
300 MHz
1100
1100
1100
1100
300
408-943-2600
MHz
Unit
mA
DDQ
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Related parts for CY7C1568V18-375BZXC

CY7C1568V18-375BZXC Summary of contents

Page 1

... K and K. Read data is driven on the rising edges of K and K. Each address location is associated with two 8-bit words (CY7C1566V18), 9-bit words (CY7C1577V18), 18-bit words (CY7C1568V18), or 36-bit words (CY7C1570V18) that burst sequentially into or out of the device. Asynchronous inputs include an output impedance matching input (ZQ) ...

Page 2

... Logic Block Diagram (CY7C1577V18 (21:0) Address Register LD K CLK K Gen. DOFF V REF Control R/W Logic BWS [0] Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Write Write Reg Reg Output Logic Control Read Data Reg Reg. Reg. 8 Reg. Write Write Reg Reg Output Logic Control Read Data Reg ...

Page 3

... Logic Block Diagram (CY7C1568V18 (20:0) Address Register LD K CLK K Gen. DOFF V REF Control R/W Logic BWS [1:0] Logic Block Diagram (CY7C1570V18 (19:0) Address Register LD K CLK K Gen. DOFF V REF Control R/W Logic BWS [3:0] Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 ...

Page 4

... Pin Configuration The pin configuration for CY7C1566V18, CY7C1577V18, CY7C1568V18, and CY7C1570V18 follow DQ4 DQ5 H DOFF V V REF DDQ DQ6 DQ7 R TDO TCK DQ4 DQ5 H DOFF V V REF DDQ DQ6 DQ7 R TDO TCK A Note 2. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level. ...

Page 5

... Pin Configuration (continued) The pin configuration for CY7C1566V18, CY7C1577V18, CY7C1568V18, and CY7C1570V18 follow DQ9 DQ10 DQ11 F NC DQ12 DQ13 H DOFF V V REF DDQ DQ14 L NC DQ15 DQ16 DQ17 R TDO TCK NC/144M DQ27 DQ18 DQ28 D NC DQ29 DQ19 DQ20 F NC DQ30 DQ21 ...

Page 6

... Address Inputs. Sampled on the rising edge of the K clock during active read and write operations. These Synchronous address inputs are multiplexed for both read and write operations. Internally, the device is organized arrays each for CY7C1566V18 arrays each for CY7C1577V18 arrays each 18) for CY7C1568V18, and arrays each 36) for CY7C1570V18. R/W Input Synchronous Read/Write Input ...

Page 7

... Ground for the Device Power Supply Power Supply Inputs for the Outputs of the Device. DDQ Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Pin Description output impedance are set to 0.2 x RQ, where resistor connected [x:0] that enables the minimum DDQ Page ...

Page 8

... CY7C1566V18, CY7C1577V18, and CY7C1570V18. Read Operations The CY7C1568V18 is organized internally as two arrays 18. Accesses are completed in a burst of 2 sequential 18-bit data words. Read operations are initiated by asserting R/W HIGH and LD LOW at the rising edge of the positive input clock (K). The address presented to the address inputs is stored in the read address register ...

Page 9

... Echo Clock1/Echo Clock1 Echo Clock2/Echo Clock2 Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 DLL These chips use a Delay Lock Loop (DLL) that is designed to function between 120 MHz and the specified maximum clock frequency. The DLL may be disabled by applying ground to the DOFF pin ...

Page 10

... Truth Table The truth table for CY7C1566V18, CY7C1577V18, CY7C1568V18, and CY7C1570V18 follows. Operation Write Cycle: Load address; wait one cycle; input write data on consecutive K and K rising edges. Read Cycle: (2.5 cycle Latency) Load address; wait two and half cycle; read data on consecutive K and K rising edges. ...

Page 11

... L– – Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 [3, 9] Comments [ Comments – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device. – During the data portion of a write sequence, only the lower byte (D into the device ...

Page 12

... TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins, as shown in page 15 ...

Page 13

... Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required, that is, while the data captured is shifted out, the preloaded data can be shifted in. ...

Page 14

... The state diagram for the TAP controller follows. TEST-LOGIC 1 RESET 0 1 TEST-LOGIC/ 0 IDLE Note 10. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 [10] 1 SELECT DR-SCAN 0 1 CAPTURE- SHIFT- ...

Page 15

... These characteristics apply to the TAP inputs (TMS, TCK, TDI, and TDO). Parallel load levels are specified in 12. Test conditions are specified using the load in TAP AC Test Conditions. t 13. All voltage refers to ground. Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 0 Bypass Register 2 1 ...

Page 16

... Test Data In TDI Test Data Out TDO Note 14. t and t refer to the setup and hold time requirements of latching data from the boundary scan register Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Description Figure 2. TAP Timing and Test Conditions 1.8V 50Ω ...

Page 17

... Do Not Use: This instruction is reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Value CY7C1577V18 CY7C1568V18 000 000 00000110100 00000110100 ...

Page 18

... Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Bump ID Bit Number Bump ID 10G 11F 58 5A 11G 10F 61 4B 11E 62 3A 10E 63 2A 10D 10C 66 3B 11D ...

Page 19

... SRAM behavior. To avoid this, provide 2048 cycles stable clock to relock to the desired clock frequency. REF Figure 3. Power Up Waveforms > 2048 Stable Clock DDQ Stable (< + 0.1V DC per 50 ns) Fix HIGH (tie to V DDQ ) CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 . KC Var Start Normal Operation Page [+] Feedback [+] Feedback ...

Page 20

... V REF DDQ 20. The operation current is calculated with 50% read cycle and 50% write cycle. Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Current into Outputs (LOW) ........................................ 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015)... >2001V Latch up Current..................................................... >200 mA Operating Range Range Commercial ...

Page 21

... Tested initially and after any design or process change that may affect these parameters. Parameter Description Θ Thermal Resistance JA (Junction to Ambient) Θ Thermal Resistance JC (Junction to Case) Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Test Conditions Max V , 400MHz (x8) DD Both Ports Deselected, (x9) ≥ V ≤ ...

Page 22

... Note 21. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, V levels of 0.25V to 1.25V, output loading of the specified I Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Figure 4. AC Test Loads and Waveforms V = 0.75V REF V 0.75V R = 50Ω ...

Page 23

... QVLD signal. QVLD 28. Hold to >V or < Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 400 MHz Description Min Max Min Max Min Max Min Max [23] 1 – 2.50 8.40 2.66 8.40 0.4 – ...

Page 24

... Outputs are disabled (High Z) one clock cycle after a NOP. 31. In this example, if address A4 = A3, then data Q40 = D30 and Q41 = D31. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 NOP NOP NOP ...

Page 25

... CY7C1570V18-400BZXC CY7C1566V18-400BZI CY7C1577V18-400BZI CY7C1568V18-400BZI CY7C1570V18-400BZI CY7C1566V18-400BZXI CY7C1577V18-400BZXI CY7C1568V18-400BZXI CY7C1570V18-400BZXI 375 CY7C1566V18-375BZC CY7C1577V18-375BZC CY7C1568V18-375BZC CY7C1570V18-375BZC CY7C1566V18-375BZXC CY7C1577V18-375BZXC CY7C1568V18-375BZXC CY7C1570V18-375BZXC CY7C1566V18-375BZI CY7C1577V18-375BZI CY7C1568V18-375BZI CY7C1570V18-375BZI CY7C1566V18-375BZXI CY7C1577V18-375BZXI CY7C1568V18-375BZXI CY7C1570V18-375BZXI Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Package Package Type Diagram 51-85195 165-Ball Fine Pitch Ball Grid Array ( 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array ( ...

Page 26

... CY7C1566V18-300BZXI CY7C1577V18-300BZXI CY7C1568V18-300BZXI CY7C1570V18-300BZXI Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Package Package Type Diagram 51-85195 165-Ball Fine Pitch Ball Grid Array ( 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array ( 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array ( 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array ( ...

Page 27

... Package Diagram Document Number: 001-06551 Rev. *E CY7C1566V18, CY7C1577V18 CY7C1568V18, CY7C1570V18 Figure 6. 165-Ball FBGA ( 1.4 mm) 51-85195-*A Page [+] Feedback [+] Feedback ...

Page 28

... Document History Page Document Title: CY7C1566V18/CY7C1577V18/CY7C1568V18/CY7C1570V18, 72-Mbit DDR-II+ SRAM 2-Word Burst Architec- ture (2.5 Cycle Read Latency) Document Number: 001-06551 Issue Orig. of REV. ECN No. Date Change ** 432718 See ECN NXR *A 437000 See ECN IGS *B 461934 See ECN NXR *C 497567 See ECN ...

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