MT47H32M16BN-3 IT:D TR Micron Technology Inc, MT47H32M16BN-3 IT:D TR Datasheet - Page 120
![IC DDR2 SDRAM 512MBIT 3NS 84FBGA](/photos/7/23/72318/mfg557-84-fbga_sml.jpg)
MT47H32M16BN-3 IT:D TR
Manufacturer Part Number
MT47H32M16BN-3 IT:D TR
Description
IC DDR2 SDRAM 512MBIT 3NS 84FBGA
Manufacturer
Micron Technology Inc
Datasheet
1.MT47H128M4BT-37EA_TR.pdf
(129 pages)
Specifications of MT47H32M16BN-3 IT:D TR
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
512M (32Mx16)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
-40°C ~ 85°C
Package / Case
84-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Precharge Power-Down Clock Frequency Change
Figure 77: Input Clock Frequency Change During Precharge Power-Down Mode
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
DQS, DQS#
Command
Address
ODT
CK#
CKE
DM
DQ
CK
High-Z
High-Z
Valid 4
Valid
T0
t CH
power-down mode
t CK
Enter precharge
Notes:
t CL
Previous clock frequency
NOP
T1
When the DDR2 SDRAM is in precharge power-down mode, ODT must be turned off
and CKE must be at a logic LOW level. A minimum of two differential clock cycles must
pass after CKE goes LOW before clock frequency may change. The device input clock
frequency is allowed to change only within minimum and maximum operating frequen-
cies specified for the particular speed grade. During input clock frequency change, ODT
and CKE must be held at stable LOW levels. When the input clock frequency is changed,
new stable clocks must be provided to the device before precharge power-down may be
exited, and DLL must be reset via MR after precharge power-down exit. Depending on
the new clock frequency, additional LM commands might be required to adjust the CL,
WR, AL, and so forth. Depending on the new clock frequency, an additional LM com-
mand might be required to appropriately set the WR MR9, MR10, MR11. During the
DLL relock period of 200 cycles, ODT must remain off. After the DLL lock time, the
DRAM is ready to operate with a new clock frequency.
1. A minimum of 2 ×
2. When the new clock frequency has changed and is stable, a minimum of 1 ×
2 x t CK (MIN) 1
ing clock frequencies.
quired prior to exiting precharge power-down.
T2
t CKE (MIN) 3
T3
Frequency
Precharge Power-Down Clock Frequency Change
change
t
CK is required after entering precharge power-down prior to chang-
Ta0
120
1 x t CK (MIN) 2
t CH
power-down mode
t CK
Exit precharge
t CL
NOP
Ta1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
New clock frequency
NOP
t XP
Ta2
t CKE (MIN) 3
DLL RESET
Ta3
LM
Indicates a break in
time scale
©2004 Micron Technology, Inc. All rights reserved.
200 x t CK
NOP
Ta4
t
Don’t Care
Valid
Valid
CK is re-
Tb0
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