W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 51

• Manufacturer Part Number: W25Q32BVSSIG
• Description: IC SPI FLASH 32MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

CLK
(IO
(IO
/CS
DO
DI
0
1
)
)
Mode 3
Mode 0
*
= MSB
0
1
Instruction (ABh)
2
Figure 28b. Release Power-down / Device ID Instruction Sequence Diagram
3
4
High Impedance
5
6
7
23
*
8
22
3 Dummy Bytes
9
2
29
- 51 -
1
30
0
31
*
7
32
6
33
5
34
Device ID
4
Publication Release Date: April 01, 2011
35
3
36
2
37
1
Power-down current
38
0
tRES2
W25Q32BV
Mode 3
Mode 0
Stand-by current
Revision F