MT46H16M32LFCX-5 IT:B Micron Technology Inc, MT46H16M32LFCX-5 IT:B Datasheet - Page 15
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MT46H16M32LFCX-5 IT:B
Manufacturer Part Number
MT46H16M32LFCX-5 IT:B
Description
IC DDR SDRAM 512MBIT 90VFBGA
Manufacturer
Micron Technology Inc
Datasheet
1.MT46H16M32LFCX-5B.pdf
(98 pages)
Specifications of MT46H16M32LFCX-5 IT:B
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
512M (16M x 32)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
-40°C ~ 85°C
Package / Case
90-VFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- Current page: 15 of 98
- Download datasheet (4Mb)
Package Dimensions
Figure 6: 60-Ball VFBGA (8mm x 9mm)
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls are
Ø0.42 on Ø0.4 SMD
ball pads.
Seating
plane
60x Ø0.45
7.2
0.1 A
0.8 TYP
0.8 TYP
3.6
Note:
A
9
8
1. All dimensions are in millimeters.
7
8 ±0.1
6.4
3.2
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
4.5 ±0.05
0.65 ±0.05
15
Ball A1 ID
0.3 ±0.025
512Mb: x16, x32 Mobile LPDDR SDRAM
9 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
© 2004 Micron Technology, Inc. All rights reserved.
Micron logo
to be lased
ball A1 ID
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