MT46V32M16TG-6T IT:F TR Micron Technology Inc, MT46V32M16TG-6T IT:F TR Datasheet - Page 14
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MT46V32M16TG-6T IT:F TR
Manufacturer Part Number
MT46V32M16TG-6T IT:F TR
Description
IC DDR SDRAM 512MBIT 6NS 66TSOP
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46V32M16P-5BF_TR.pdf
(91 pages)
Specifications of MT46V32M16TG-6T IT:F TR
Format - Memory
RAM
Memory Type
DDR SDRAM
Memory Size
512M (32Mx16)
Speed
6ns
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
-40°C ~ 85°C
Package / Case
66-TSOP
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
700ps
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Package Type
TSOP
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
195mA
Pin Count
66
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Figure 9:
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
512Mb_DDR_x4x8x16_D2.fm - 512Mb DDR: Rev. N; Core DDR Rev. B 2/09 EN
CONDITION. THE PRE-REFLOW
SEATING PLANE
REFERS TO POST REFLOW
SOLDER BALL DIAMETER
DIAMETER IS Ø 0.40.
0.10 C
11.00
60-Ball FBGA (10mm x 12.5mm)
60X Ø
5.50 ±0.05
BALL A9
Notes:
.45
0.85 ±0.05
C
1. All dimensions are in millimeters.
2. Topside part marking decoder can be found on Micron’s Web site.
3.20 ±0.05
0.80 (TYP)
10.00 ±0.10
6.40
1.80
CTR
C L
5.00 ±0.05
C L
BALL A1
BALL A1 ID
1.00
TYP
6.25 ±0.05
12.50 ±0.10
14
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
512Mb: x4, x8, x16 DDR SDRAM
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø .33
NON SOLDER MASK DEFINED
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL #1 ID
Package Dimensions
©2000 Micron Technology, Inc. All rights reserved.