ZSPM4121KIT ZMDI, ZSPM4121KIT Datasheet - Page 15

• Manufacturer Part Number: ZSPM4121KIT
• Description: Power Management IC Development Tools DC-DC Converter Kit for ZSPM4121
• Manufacturer: ZMDI
• Type: Linear Regulators - Standardr

Specifications of ZSPM4121KIT

• Rohs: yes
• Product: Evaluation Kits
• Tool Is For Evaluation Of: ZSPM4121
• Input Voltage: 1.2 V to 5.5 V
• Output Voltage: 3 A
• Maximum Operating Temperature: + 55 C
• Minimum Operating Temperature: - 20 C
• Output Current: 3 A
• For Use With: ZSPM4121

Figure 6.4
6.3.
Layout recommendations for a single-layer PCB: Utilize as much copper area for power management as possible.
In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by using a low
thermal impedance attachment method (solder paste or thermal conductive epoxy).
In both of the methods mentioned above, it is advisable to use as much copper trace as possible to dissipate the
heat.
Figure 6.5
Important:
guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the
circuit board.
Data Sheet
April 23, 2012
ZSPM4121
Under-Voltage Load Switch for Smart Battery Management
Single-Layer PCB Layout
If the attachment method is NOT implemented correctly, the functionality of the product is NOT
Conducting Heat Away from the Die using an Exposed Pad Package
Application Using a Single-Layer PCB
Note: NOT to scale.
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.00
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
Use as much copper area
as possible for heat spread
Package Thermal Pad
Package Outline
Ground Layer, 1oz Cu
Bottom Layer, 2oz Cu
Single Layer, 2oz Cu
Signal Layer, 1oz Cu
Mold compound
Die
Epoxy Die attach
Exposed pad
Solder
5% - 10% Cu coverage
Thermal Vias with Cu plating
90% Cu coverage
20% Cu coverage
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