ZSPM4121KIT ZMDI, ZSPM4121KIT Datasheet - Page 14

• Manufacturer Part Number: ZSPM4121KIT
• Description: Power Management IC Development Tools DC-DC Converter Kit for ZSPM4121
• Manufacturer: ZMDI
• Type: Linear Regulators - Standardr

Specifications of ZSPM4121KIT

• Rohs: yes
• Product: Evaluation Kits
• Tool Is For Evaluation Of: ZSPM4121
• Input Voltage: 1.2 V to 5.5 V
• Output Voltage: 3 A
• Maximum Operating Temperature: + 55 C
• Minimum Operating Temperature: - 20 C
• Output Current: 3 A
• For Use With: ZSPM4121

6.2.
The following are guidelines for mounting the exposed pad ZSPM4121 on a multi-Layer PCB with ground a plane.
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package
thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die
area, number of thermal vias, and thickness of copper, etc.
Figure 6.2
Figure 6.3
Figure 6.4 is a representation of how the heat can be conducted away from the die using an exposed pad
package. Each application will have different requirements and limitations, and therefore the user should use
sufficient copper to dissipate the power in the system. The output current rating for the linear regulators might
need to be de-rated for ambient temperatures above 85°C. The de-rated value will depend on calculated worst
case power dissipation and the thermal management implementation in the application.
Data Sheet
April 23, 2012
ZSPM4121
Under-Voltage Load Switch for Smart Battery Management
Multi-Layer PCB Layout
JEDEC Standard FR4 Multi-Layer Board – Cross-Sectional View
Package and PCB Land Configuration for Multi-Layer PCB
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.00
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
4 Plane
2 Plane
1.5748mm
(square)
Pad (bottom trace)
Thermal Isolation
Power plane only
Package Solder
Package Solder
Thermal Via
Pad
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Vias
Package Outline
Component Traces
1.5038 - 1.5748 mm
1.0142 - 1.0502 mm
0.5246 - 0.5606 mm
Component Trace
0.0 - 0.071 mm Board
Ground Plane
Power Plane
Base & Bottom Pad
(2oz Cu)
(1oz Cu)
(1oz Cu)
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