AT45DB321D-CCU Adesto Technologies, AT45DB321D-CCU Datasheet - Page 43

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AT45DB321D-CCU

Manufacturer Part Number
AT45DB321D-CCU
Description
Flash 32M 2.7-3.6V, 66Mhz Serial Flash
Manufacturer
Adesto Technologies
Datasheet

Specifications of AT45DB321D-CCU

Rohs
yes
Data Bus Width
8 bit
Memory Type
Data Flash
Memory Size
32 Mbit
Architecture
Flexible, Uniform Erase
Timing Type
Synchronous
Interface Type
SPI
Supply Voltage - Max
3.6 V
Supply Voltage - Min
2.7 V
Maximum Operating Current
15 mA
Operating Temperature
- 40 C to + 85 C
Mounting Style
SMD/SMT
Package / Case
BGA-24
Factory Pack Quantity
378

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT45DB321D-CCU
Manufacturer:
Atmel
Quantity:
10 000
Part Number:
AT45DB321D-CCU-SL383
Manufacturer:
Adesto Technologies
Quantity:
10 000
24.
Ordering Information
Ordering Code Detail
Green Package Options (Pb/Halide-free/RoHS Compliant)
Notes:
AT45DB321D-MU
AT45DB321D-MU-SL954
AT45DB321D-MU-SL955
AT45DB321D-MWU
AT45DB321D-MWU-SL954
AT45DB321D-MWU-SL955
AT45DB321D-SU
AT45DB321D-SU-SL954
AT45DB321D-SU-SL955
AT45DB321D-TU
AT45DB321D-CU
AT45DB321D-MU-2.5
AT45DB321D-SU-2.5
8M1-A
8MW
8S2
28T
24C3
1.
2.
3.
4.
Ordering Code
Device Revision
Product Family
Device Density
The shipping carrier option is not marked on the devices.
Standard parts are shipped with the page size set to 528 bytes.
The user is able to configure these parts to a 512-byte page size, if desired.
Parts ordered with suffix SL954 are shipped in bulk, with the page size set to 512 bytes.
Parts will have “954” or “SL954” marked on them.
Parts ordered with suffix SL955 are shipped in tape and reel, with the page size set to 512 bytes.
Parts will have “955” or “SL955” marked on them.
32 = 32-megabit
Designator
Interface
1 = Serial
8-pad, 6 x 5 x 1.0mm, very thin micro lead-frame package MLF
8-pad, 8 x 6 x 1.0mm, very thin micro lead-frame package MLF (VDFN)
8-lead, 0.209in-wide, plastic gull wing small outline package (EIAJ SOIC)
28-lead, 8mm x 13.4mm, plastic thin small outline package, type I (TSOP)
24-ball, 6mm x 8mm x 1.4mm ball grid array with a 1mm pitch 5 x 5 ball matrix
(1)(2)
(3)
(4)
(3)
(4)
(3)
(4)
A T 4 5 D
Package
8M1-A
8M1-A
24C3
8MW
8S2
28T
8S2
B
3 2
1 D –
Lead Finish
Package Type
Matte Sn
Matte Sn
Matte Sn
MW U
2.7V to 3.6V
2.7V to 3.6V
2.5V to 3.6V
Operating
Voltage
Device Grade
U = Matte Sn lead finish, industrial
Package Option
M
MW =
S
T
C
(VDFN)
AT45DB321D [DATASHEET]
temperature range (-40°C to +85°C)
=
=
=
=
8-pad, 6 x 5 x 1mm MLF (VDFN)
8-pad, 8 x 6 x 1mm MLF (VDFN)
8-lead, 0.209" wide SOIC
28-lead, TSOP
24 Ball BGA
f
SCK
66
66
50
(MHz)
3597R–DFLASH–11/2012
Operation Range
(-40C to 85C)
2.7V to 3.6V
Industrial
43

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