LPC1113FHN33/203,5 NXP Semiconductors, LPC1113FHN33/203,5 Datasheet - Page 11
LPC1113FHN33/203,5
Manufacturer Part Number
LPC1113FHN33/203,5
Description
ARM Microcontrollers - MCU Cortex-M0 24 kB flash up to 8kB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1113FHN333035.pdf
(538 pages)
Specifications of LPC1113FHN33/203,5
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1113
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
24 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
260
- Current page: 11 of 538
- Download datasheet (5Mb)
NXP Semiconductors
1.4 Block diagram
UM10398
User manual
Fig 1.
CT32B0_MAT[3:0]
CT32B1_MAT[3:0]
CT16B0_MAT[2:0]
CT16B1_MAT[1:0]
DTR, DSR, CTS
(1) LQFP48 packages only.
(2) Not on LPC1112FDH20/102.
(3) All pins available on LQFP48 and HVQFN33 packages. CT16B1_MAT1 not available on TSSOP28/DIP28 packages.
(4) AD[7:0] available on LQFP48 and HVQFN33 packages. AD[5:0] available on TSSOP28/DIP28/HVQFN24packages. AD[4:0]
(5) All pins available on LQFP48 packages. RXD, TXD, DTR, CTS, RTS available on HVQFN 33 packages. RXD, TXD, CTS, RTS
CT32B0_CAP0
CT32B1_CAP0
CT16B0_CAP0
CT16B1_CAP0
DCD, RI, RTS
GPIO ports
PIO0/1/2/3
CT32B1_MAT3, CT16B1_CAP0, CT16B1_MAT[1:0], CT32B0_CAP0 not available on TSSOP20/SO20 packages.
CT16B1_MAT[1:0], CT32B0_CAP0 not available on the HVQFN24 package. XTALOUT not available on LPC1112FHN24.
available on TSSOP20/SO20 packages.
available on TSSOP28/DIP28 packages. RXD, TXD available on TSSOP20/SO20 packages.
LPC111x block diagram (LPC1100 and LPC1100L series)
RXD
TXD
(5)
(5)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
,
LPC1110/11/12/13/14
HIGH-SPEED
GPIO
32-bit COUNTER/TIMER 0
32-bit COUNTER/TIMER 1
16-bit COUNTER/TIMER 0
16-bit COUNTER/TIMER 1
system bus
UART
slave
CORTEX-M0
All information provided in this document is subject to legal disclaimers.
TEST/DEBUG
INTERFACE
SWD
ARM
Rev. 12 — 24 September 2012
Chapter 1: LPC111x/LPC11Cxx Introductory information
4/8/16/24/32 kB
slave
FLASH
AHB-LITE BUS
slave
AHB TO APB
BRIDGE
slave
1/2/4/8 kB
SRAM
POR
IRC
slave
XTALOUT
SYSTEM CONTROL
POWER CONTROL,
ROM
GENERATION,
10-bit ADC
I
IOCONFIG
2
FUNCTIONS
C-BUS
SPI1
SYSTEM
SPI0
WDT
PMU
(3)
XTALIN
CLOCK
clocks and
controls
(1)
(2)
RESET
002aae696
UM10398
© NXP B.V. 2012. All rights reserved.
CLKOUT
AD[7:0]
SCL
SDA
SCK0, SSEL0
MISO0, MOSI
SCK1, SSEL1
MISO1, MOSI
11 of 538
(4)
Related parts for LPC1113FHN33/203,5
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: