SIM3L167-C-GQ Silicon Labs, SIM3L167-C-GQ Datasheet - Page 77
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SIM3L167-C-GQ
Manufacturer Part Number
SIM3L167-C-GQ
Description
ARM Microcontrollers - MCU 256KB, DC-DC, 40x4 LCD, AES, TQFP80
Manufacturer
Silicon Labs
Datasheet
1.SIM3L166-C-GQ.pdf
(95 pages)
Specifications of SIM3L167-C-GQ
Rohs
yes
Core
ARM Cortex M3
Processor Series
SiM3L1xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
256 KB
Data Ram Size
32 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.8 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
TQFP-80
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
A/d Channels Available
24
Interface Type
I2C, SPI
Length
14 mm
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
62
Number Of Timers
3
On-chip Dac
Yes
Program Memory Type
Flash
Supply Voltage - Max
3.8 V
Supply Voltage - Min
1.8 V
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SIM3L167-C-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Company:
Part Number:
SIM3L167-C-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
6.4.1. TQFP-80 Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 µm minimum, all the way around the pad.
6.4.2. TQFP-80 Stencil Design
6.4.3. TQFP-80 Card Assembly
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
good solder paste release.
Components.
Rev 0.5
SiM3L1xx
77