S9S12G48F1CLC Freescale Semiconductor, S9S12G48F1CLC Datasheet - Page 1287
S9S12G48F1CLC
Manufacturer Part Number
S9S12G48F1CLC
Description
16-bit Microcontrollers - MCU S12Core,48k Flash,Au
Manufacturer
Freescale Semiconductor
Datasheet
1.S9S12G96F0CLL.pdf
(1292 pages)
Specifications of S9S12G48F1CLC
Rohs
yes
Core
S12
Processor Series
MC9S12G
Data Bus Width
16 bit
Maximum Clock Frequency
25 MHz
Program Memory Size
48 KB
Data Ram Size
2 KB
On-chip Adc
Yes
Operating Supply Voltage
3.13 V to 5.5 V
Operating Temperature Range
- 40 C to + 125 C
Package / Case
LQFP-32
Mounting Style
SMD/SMT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S9S12G48F1CLC
Manufacturer:
ST
Quantity:
560
Company:
Part Number:
S9S12G48F1CLC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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D.7
Bondpad Coordinates
Freescale Semiconductor
KGD Information
Die Pad
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
Bond Post
MC9S12G Family Reference Manual, Rev.1.23
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
Table D-1. Bondpad Coordinates
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
-1707.5
-1506.5
Y Coordinate
-1472.06
-1472.06
Die Pad
-1054.5
-1196.5
-1347.5
1347.5
1223.5
1116.5
1009.5
-201.5
-311.5
-396.5
-483.5
-578.5
-683.5
-797.5
-921.5
902.5
795.5
688.5
603.5
496.5
241.5
136.5
-91.5
22.5
369
Function
RESET
VDDX1
VSSX1
VDDR
BKGD
PE[0]
VSS1
PE[1]
TEST
PB[0]
PB[1]
PB[2]
PA[0]
PA[1]
PA[2]
PA[3]
PA[4]
PA[5]
PA[6]
PA[7]
PJ[6]
PJ[5]
PJ[4]
PJ[0]
PJ[1]
PJ[2]
PJ[3]
Package and Die Information
1289
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