STPS5L25B-1 STMICROELECTRONICS [STMicroelectronics], STPS5L25B-1 Datasheet

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STPS5L25B-1

Manufacturer Part Number
STPS5L25B-1
Description
LOW DROP POWER SCHOTTKY RECTIFIER
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet

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STPS5L25B-1
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MAIN PRODUCT CHARACTERISTICS
FEATURES AND BENEFITS
DESCRIPTION
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC con-
verters.
This device is especially intended for use as a Rec-
tifier at the secondary of 3.3V SMPS units.
ABSOLUTE RATINGS (limiting values)
* :
August 1999 - Ed: 3A
Symbol
I
LESS POWER DISSIPATION AND REDUCED
HEATSINK
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
PACKAGE
VERY LOW FORWARD VOLTAGE DROP FOR
OPTIMIZED CONDUCTION/REVERSE LOSSES
HIGH POWER SURFACE MOUNT MINIATURE
AVALANCHE RATED
V
F(RMS)
dV/dt
I
I
I
I
F(AV)
T
dPtot
RRM
RSM
FSM
RRM
Tj
stg
dTj
V
Tj (max)
F
V
I
F(AV)
(max)
®
RRM
Repetitive peak reverse voltage
RMS forward current
Average forward current
Surge non repetitive forward current
Repetitive peak reverse current
Non repetitive peak reverse current
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
Rth j a
1
thermal runaway condition for a diode on its own heatsink
LOW DROP POWER SCHOTTKY RECTIFIER
0.35 V
150°C
25 V
5 A
Parameter
Tc = 145°C
tp = 10 ms Sinusoidal
tp=2 s square F=1kHz
tp = 100 s square
4
STPS5L25B
1
NC
DPAK
= 0.5
2
3
3
STPS5L25B/B-1
- 65 to + 150
4
2
4 (TAB)
10000
Value
STPS5L25B-1
150
25
75
7
5
1
2
IPAK
Unit
V/ s
1
NC
V
A
A
A
A
A
C
C
2
3
1/5

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STPS5L25B-1 Summary of contents

Page 1

... August 1999 - Ed 150°C 0. STPS5L25B Parameter Tc = 145° Sinusoidal tp=2 s square F=1kHz tp = 100 s square STPS5L25B/B (TAB IPAK DPAK STPS5L25B-1 Value 0 150 150 10000 Unit ...

Page 2

... STPS5L25B/B-1 THERMAL RESISTANCES Symbol R Junction to case th(j-c) STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions I * Reverse leakage current Forward voltage drop F Pulse test : * tp = 380 s, < evaluate the maximum conduction losses use the following equation : 0 0.030 I F(AV) F (RMS) Fig. 1: Average forward power dissipation versus average forward current ...

Page 3

... Fig. 8: Thermal resistance junction to ambient ver- sus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 m). Rth(j-a) (°C/W) 100 STPS5L25B/B-1 = 0.5 = 0.2 Single pulse tp(s) =tp/T 1.0E-3 1.0E-2 1.0E-1 VR( S(Cu) (cm²) ...

Page 4

... STPS5L25B/B-1 PACKAGE MECHANICAL DATA DPAK FOOT PRINT DIMENSIONS (in millimeters) 6.7 1.6 2.3 2.3 4/5 REF 6 1.6 DIMENSIONS Millimeters Inches Min. Max Min. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6 ...

Page 5

... STPS5L25B STPS5L25B STPS15LB-TR STPS5L25B STPS5L25B-1 STPS5L25B Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics ...

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