HCS11MS Intersil Corporation, HCS11MS Datasheet
HCS11MS
Related parts for HCS11MS
HCS11MS Summary of contents
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... The HCS11MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The HCS11MS is supplied lead Weld Seal Ceramic flatpack (K suffi Weld Seal Ceramic Dual-In-Line Package (D suffix). Truth Table ...
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... No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Specifications HCS11MS Reliability Information Thermal Impedance . . . . . . . . . . . . . . . . ...
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... VIL = 0.12(VCC RAD, IOH = -50 A Input Leakage Current IIN VCC = 5.5V, VIN = VCC or GND Noise Immunity FN VCC = 4.5V, VIH = 0.70(VCC), Functional Test VIL = 0.30(VCC) at 200K RAD, VIL = 0.12(VCC RAD (Note 3) Specifications HCS11MS GROUP (NOTES SUB- CONDITIONS GROUPS TEMPERATURE 9 10, 11 +125 9 10, 11 ...
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... CONFORMANCE GROUPS METHOD Group E Subgroup 2 5005 NOTE: 1. Except FN test which will be performed 100% Go/No-Go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONDITIONS (Note 1) Specifications HCS11MS 200K RAD LIMITS (NOTES 1, 2) TEMP- CONDITIONS ERATURE MIN o + +25 C 0.5V is recognized as a logic “ ...
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... OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 Specifications HCS11MS 1/2 VCC = 3V 0.5V VCC = 10, 11, 13 for static burn-in. 5% for dynamic burn-in. TABLE 9. IRRADIATION TEST CONNECTIONS GROUND 10, 11, 13 Load Circuit ...
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... Thickness: 13k 2.6k DIE ATTACH: Material: Silver Epoxy WORST CASE CURRENT DENSITY <2 A/cm BOND PAD SIZE: 100 m x 100 mils Metallization Mask Layout B1 (2) A2 (3) B2 (4) C2 (5) HCS11MS HCS11MS A1 VCC C1 (1) (14) (13) (6) (7) (8) Y2 GND Y3 7-140 (12) Y1 (11) C3 (10) B3 (9) A3 ...