EN5339QI ENPIRION [Enpirion, Inc.], EN5339QI Datasheet - Page 17

• Manufacturer Part Number: EN5339QI
• Description: 3A Low Profile Synchronous Buck DC-DC Converter with Integrated Inductor
• Manufacturer: ENPIRION [Enpirion, Inc.]

Design Considerations for Lead
Exposed Metal Pads on Package Bottom
QFN lead- frame based package technology utilizes exposed metal pads on the bottom of the package that
provide improved thermal dissipation ,
thickness, larger lead size and pitch, and excellent lead co
integrated module consisting of multiple internal devices, the lead
mechanical support of these devices result
Only the two large thermal pads and the perimeter leads are to be mechanically/electrically connected to the
Only the two large thermal pads and the perimeter leads are to be mechanically/electrically connected to the
PCB through a SMT soldering process. All other exposed metal is to remain free of any in
PCB through a SMT soldering process. All other exposed metal is to remain free of any in terconnection to the
PCB. Figure 9 shows the recommended PCB metal layout for the EN5339 package. A GND pad with a solder
mask "bridge" to separate into two pads and 24 signal pads are to be used to match the metal on the package.
mask "bridge" to separate into two pads and 24 signal pads are to be used to match the metal on the package.
The PCB should be clear of any other metal, including trace
shorting.
The Solder Stencil Aperture should be smaller than the PCB ground pad. This will prevent excess solder from
The Solder Stencil Aperture should be smaller than the PCB ground pad. This will prevent excess solder from
causing bridging between adjacent pins or other exposed metal under the package. P
causing bridging between adjacent pins or other exposed metal under the package. P lease consult the
Enpirion Manufacturing Application Note for more details and recommendations.
© Enpirion 2012 all rights reserved, E&OE
Design Considerations for Lead -Frame Based Modules
Exposed Metal Pads on Package Bottom
integrated module consisting of multiple internal devices, the lead - frame provides circuit interconnection and
mechanical support of these devices resulting in multiple exposed metal pads on the package bottom.
Only the two large thermal pads and the perimeter leads are to be mechanically/electrically connected to the
PCB through a SMT soldering process. All other exposed metal is to remain free of any in
mask "bridge" to separate into two pads and 24 signal pads are to be used to match the metal on the package.
The PCB should be clear of any other metal, including traces, vias, etc., under the package to avoid electrical
The Solder Stencil Aperture should be smaller than the PCB ground pad. This will prevent excess solder from
causing bridging between adjacent pins or other exposed metal under the package. P
Enpirion Manufacturing Application Note for more details and recommendations.
06903
Note: Grey area highlights exposed metal that is not to be mechanically or electrically connected to th
frame based package technology utilizes exposed metal pads on the bottom of the package that
frame based package technology utilizes exposed metal pads on the bottom of the package that
Grey area highlights exposed metal that is not to be mechanically or electrically connected to th
Grey area highlights exposed metal that is not to be mechanically or electrically connected to th e PCB.
shows the recommended PCB metal layout for the EN5339 package. A GND pad with a solder
shows the recommended PCB metal layout for the EN5339 package. A GND pad with a solder
lead size and pitch, and excellent lead co -planarity. As the EN5339 package is a fully
Figure 9 .
. Recommended Footprint for PCB (Top View)
, lower package thermal resistance, smaller package footprint and
ing in multiple exposed metal pads on the package bottom.
package thermal resistance, smaller package footprint and
September 12, 2012
s, vias, etc., under the package to avoid electrical
frame provides circuit interconnection and
As the EN5339 package is a fully
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EN5339QI
, Page 17
Rev: B