W25P10 WINBOND [Winbond], W25P10 Datasheet - Page 32

• Manufacturer Part Number: W25P10
• Description: 1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI
• Manufacturer: WINBOND [Winbond]

9. PACKAGE SPECIFICATION
9.1
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
8-Pin SOIC 150-mil (Winbond Package Code SN)
SYMBOL
E1
D
CP
A1
A2
e
A
C
E
b
L
θ
(2)
(3)
(3)
1.47
0.10
0.33
0.19
4.80
5.80
3.80
0.40
MIN
---
---
0
o
MILLIMETERS
1.27 BSC
TYP.
1.60
1.45
0.41
0.20
4.85
6.00
3.90
0.71
---
---
---
W25P10, W25P20 AND W25P40
- 32 -
MAX
1.72
0.24
0.50
0.25
4.95
6.19
4.00
1.27
0.10
---
8
o
0.0075
0.058
0.004
0.013
0.189
0.228
0.150
0.015
MIN
---
---
0
o
0.050 BSC
INCHES
0.063
0.057
0.016
0.008
0.191
0.236
0.154
0.028
TYP.
---
---
---
0.0098
0.068
0.009
0.020
0.195
0.244
0.157
0.050
0.004
MAX
---
8
o