NAND02GW3B2CN1F STMICROELECTRONICS [STMicroelectronics], NAND02GW3B2CN1F Datasheet - Page 60
NAND02GW3B2CN1F
Manufacturer Part Number
NAND02GW3B2CN1F
Description
1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.NAND02GW3B2CN1F.pdf
(62 pages)
- Current page: 60 of 62
- Download datasheet (712Kb)
Part numbering
13
60/62
Part numbering
Table 29.
1. x16 organization only available for MCP Products.
2. For NAND02G-B2C devices only.
3. For NAND01G-B2B devices only.
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to
’1’. For further information on any aspect of this device, please contact your nearest ST
Sales Office.
Example:
Device Type
NAND Flash Memory
Density
01G = 1Gb
02G = 2Gb
Operating Voltage
R = V
W = V
Bus Width
3 = x8
4 = x16
Family Identifier
B = 2112 Bytes/ 1056 Word Page
Device Options
2 = Chip Enable Don't Care Enabled
Product Version
B= Second Version (1Gb devices)
C= Third Version (2Gb devices)
Package
N = TSOP48 12 x 20mm
ZA = VFBGA63 9.5 x 12 x 1mm, 0.8mm pitch
ZA= VFBGA63 9 x 11 x 1mm, 0.8mm pitch
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel Packing
DD
DD
(1)
= 1.7 to 1.95V
= 2.7 to 3.6V
Ordering Information Scheme
(3)
(2)
NAND02GR3B2C ZA 6
NAND01G-B2B, NAND02G-B2C
E
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