IP4855CX25 NXP [NXP Semiconductors], IP4855CX25 Datasheet - Page 25

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IP4855CX25

Manufacturer Part Number
IP4855CX25
Description
SD 3.0-compliant memory card integrated voltage level translator with EMI filter and ESD protection
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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Company:
Part Number:
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NXP Semiconductors
17. Abbreviations
IP4855CX25
Product data sheet
Table 19.
Table 20.
Symbol
t
t
Acronym
T
t
t
t
dT/dt
DUT
EMI
ESD
FR4
MMC
NSMD
OSP
PCB
RoHS
SD
WLCSP
1
2
3
4
5
Fig 15. Pb-free solder reflow profile
reflow(peak)
The device can withstand at least three reflows of this profile.
Reflow soldering process characteristics
Abbreviations
Parameter
peak reflow temperature
time 1
time 2
time 3
time 4
time 5
rate of change of
temperature
SD 3.0-compliant memory card integrated dual voltage level translator
All information provided in this document is subject to legal disclaimers.
Description
Device Under Test
ElectroMagnetic Interference
ElectroStatic Discharge
Flame Retard 4
MultiMedia Card
Non-Solder Mask Design
Organic Solderability Preservation
Printed-Circuit Board
Restriction of Hazardous Substances
Secure Digital
Wafer-Level Chip-Scale Package
T
reflow(peak)
Rev. 1 — 13 September 2012
(°C)
250
230
217
T
pre-heat
t
1
Conditions
soak time
time during T  250 C
time during T  230 C
time during T > 217 C
cooling rate
pre-heat
t
2
t
3
t
t
4
5
cooling rate
Min
230
60
-
10
30
-
-
2.5
IP4855CX25
001aai161
t (s)
Typ
-
-
-
-
-
-
-
-
© NXP B.V. 2012. All rights reserved.
Max
260
180
30
50
150
540
6
4.0
25 of 29
Unit
C
s
s
s
s
s
C/s
C/s

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