XC2VP7 XILINX [Xilinx, Inc], XC2VP7 Datasheet - Page 72
XC2VP7
Manufacturer Part Number
XC2VP7
Description
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet
Manufacturer
XILINX [Xilinx, Inc]
Datasheet
1.XC2VP7.pdf
(430 pages)
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DS083 (v4.7) November 5, 2007
Virtex-II Pro
Virtex™-II Pro devices are provided in -7, -6, and -5 speed
grades, with -7 having the highest performance.
Virtex-II Pro DC and AC characteristics are specified for
both commercial and industrial grades. Except the operat-
ing temperature range or unless otherwise noted, all the DC
and AC electrical parameters are the same for a particular
speed grade (that is, the timing characteristics of a -6 speed
grade industrial device are the same as for a -6 speed grade
Virtex-II Pro DC Characteristics
Table 1: Absolute Maximum Ratings
1. Unless otherwise noted, "Virtex-II Pro" refers to members of the Virtex-II Pro and/or Virtex-II Pro X families.
© 2002–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is
a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners.
DS083 (v4.7) November 5, 2007
Product Specification
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress
2. For soldering guidelines and thermal considerations, see the
3. 3.3V I/O Absolute Maximum limit applied to DC and AC signals. Refer to
AVCCAUXRX
AVCCAUXTX
Symbol
V
V
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
on the Xilinx website.
V
V
V
V
T
T
CCAUX
V
CCINT
V
V
BATT
CCO
STG
SOL
T
REF
TRX
TTX
TS
IN
J
Internal supply voltage relative to GND
Auxiliary supply voltage relative to GND
Output drivers supply voltage relative to GND
Key memory battery backup supply
Input reference voltage
3.3V I/O input voltage relative to GND (user and dedicated I/Os)
2.5V or below I/O input voltage relative to GND (user and dedicated I/Os)
Voltage applied to 3-state 3.3V output (user and dedicated I/Os)
Voltage applied to 3-state 2.5V or below output (user and dedicated I/Os)
Receive auxilliary supply voltage relative to GNDA (analog ground)
Transmit auxilliary supply voltage relative to GNDA (analog ground)
Terminal receive supply voltage relative to GND
Terminal transmit supply voltage relative to GND
Storage temperature (ambient)
Maximum soldering
temperature
Maximum junction temperature
(1)
Electrical Characteristics
(2)
R
5
7
Virtex-II Pro and Virtex-II Pro X Platform FPGAs:
Description
(2)
All regular FG/FF flip-chip packages
Pb-free FGG256 wire-bond package
Pb-free FGG456 and FGG676
wire-bond packages
(1)
www.xilinx.com
Device Packaging and Thermal Characteristics Guide
commercial device). However, only selected speed grades
and/or devices might be available in the industrial range.
All supply voltage and junction temperature specifications
are representative of worst-case conditions. The parame-
ters included are common to popular designs and typical
applications. Contact Xilinx for design considerations
requiring more detailed information.
All specifications are subject to change without notice.
DC and Switching Characteristics
XAPP659
for more details.
Virtex-II Pro X
–0.5 to 2.0
–0.5 to 3.0
–0.5 to 3.0
–0.5 to 1.6
N/A
N/A
–0.5 to V
–0.5 to V
–0.3 to 4.05
–0.3 to 4.05
–65 to +150
–0.5 to 3.75
–0.5 to 4.05
–0.3 to 3.75
–0.5 to 1.6
–0.5 to 3.0
+220
+125
CCO
CCO
Product Specification
Virtex-II Pro
–0.5 to 3.0
–0.5 to 3.0
–0.5 to 3.0
–0.5 to 3.0
+ 0.5
+ 0.5
(3)
(3)
+260
+250
Module 3 of 4
information
Units
°C
°C
°C
°C
°C
V
V
V
V
V
V
V
V
V
V
V
V
V
1
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