PCF8563TS Philips Semiconductors, PCF8563TS Datasheet - Page 27

• Manufacturer Part Number: PCF8563TS
• Description: Real-time clock/calendar
• Manufacturer: Philips Semiconductors

Philips Semiconductors
15. Revision history
9397 750 04855
Product specification
Rev Date
01
990416 -
CPCN
14.4 Package related soldering information
Description
This data sheet supersedes the version of 1998 Mar 25 (9397 750 03282):
•
•
•
•
•
Table 31: Suitability of IC packages for wave, reflow and dipping soldering methods
[1]
[2]
[3]
[4]
[5]
[6]
Mounting
Through-hole
mount
Surface mount
The format of this specification has been redesigned to comply with Philips Semiconductors’
new presentation and information standard
Added
Added
Added paragraph in
Added
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Figure 3 “Device diode protection diagram.” on page 3
Figure 4 “Voltage-low detection.” on page 5
Figure 14
to
Package
DBS, DIP, HDIP, SDIP, SIL suitable
BGA, SQFP
HLQFP, HSQFP, HSOP,
HTSSOP, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
17 on page 18
Section 8.5 “Voltage-low detector and clock monitor” on page 5
16 April 1999
[4]
, SO, SOJ
in
Section
10.
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
[2]
[3]
Real-time clock/calendar
© Philips Electronics N.V. 1999. All rights reserved.
[4] [5]
[6]
Reflow
suitable
suitable
suitable
suitable
suitable
PCF8563
[1]
Dipping
suitable
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