CHA7010-99F/00 UMS [United Monolithic Semiconductors], CHA7010-99F/00 Datasheet

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CHA7010-99F/00

Manufacturer Part Number
CHA7010-99F/00
Description
X-band GaInP HBT High Power Amplifier
Manufacturer
UMS [United Monolithic Semiconductors]
Datasheet

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Part Number
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Part Number:
CHA7010-99F/00
Manufacturer:
UMS
Quantity:
1 400
Description
The CHA7010 is a monolithic two stage
GaAs high power amplifier designed for X
band applications.
This device is manufactured using a GaInP
HBT process, including, via holes through
the substrate and air bridges. A nitride
layer protects the transistors and the
passive components. Special heat removal
techniques are implemented to guarantee
high reliability.
To simplify the assembly process;
Main Characteristics
Tamb = +25°C
ESD Protections : Electrostatic discharge sensitive device observe handling precautions !
Symbol
P_1dBc
P_sat
Ref. : DSCHA70102175 -24-June-02
G_lin
F_op
the backside of the chip is both RF and
DC grounded
bond pads and back side are gold
plated for compatibility with eutectic die
attach method and thermo-sonic or
thermo-compression bonding process.
X-band GaInP HBT High Power Amplifier
Operating frequency range
Saturated output power
Output power @ 1dBc
Linear gain
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Matching
Network
Input
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
GaAs Monolithic Microwave IC
United Monolithic Semiconductors S.A.S.
Parameter
Vctr
Vctr
Vc
Vc
Inter-stage
1/7
Main Features
n 10W output power
n High gain : > 18dB @ 10GHz
n High PAE : > 35% @ 10GHz
n On-chip bias control
n Linear collector current control
n High impedance interface for pulse
n Temperature compensated
n Chip size: 4.74 x 4.36 x 0.1 mm
Vctr
Vctr
Specifications subject to change without notice
mode
Min
8.4
Vc
Vc
Combiner
Output
Typ
9.4
10
18
8
CHA7010
Max
10.4
Unit
GHz
dB
W
W

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CHA7010-99F/00 Summary of contents

Page 1

... X-band GaInP HBT High Power Amplifier GaAs Monolithic Microwave IC Description The CHA7010 is a monolithic two stage GaAs high power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including, via holes through the substrate and air bridges. A nitride layer protects the transistors and the passive components ...

Page 2

... Vctr Collector current control voltage Tstg Storage temperature range (1) Operation of this device above anyone of these parameters may cause permanent damage. Ref. : DSCHA70102175 -24-June-02 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0 Fax : +33 (0 Parameter Parameter 2/7 Specifications subject to change without notice ...

Page 3

... Output power versus compression level : F= 8.4 to 10.4GHz Ref. : DSCHA70102175 -24-June-02 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0 Fax : +33 (0 db(S21) db(S11) db(S22) 9 9,5 10 Frequency(GHz) S-parameters Compression level (dB) 3/7 CHA7010 ...

Page 4

... Saturated output power, PAE, Gain and collector current versus frequency Ref. : DSCHA70102175 -24-June-02 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0 Fax : +33 (0 Pout @ pin = 27 dBm Pae @ pin = 27 dBm gain @ pin = 27 dBm Ic @ pin = 27 dBm 9 9,2 9,4 9,6 Frequency (GHz) ...

Page 5

... DC pads (4, 9, 17, 22 pads (6, 11, 15, 20) = 288 x 96 Pin number 18 10, 12, 14, 19, 16 11, 15 Ref. : DSCHA70102175 -24-June-02 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0 Fax : +33 (0 ...

Page 6

... The RF, DC and modulation port inter-connections should be done according to the following table: Port IN (1) Inductance (Lbonding) = 0.4nH OUT (13) Inductance (Lbonding) = 0.4nH Vc (6, 11, 15, 20)) Vctr (4, 9, 17, 22) Ref. : DSCHA70102175 -24-June-02 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0 Fax : +33 (0 ...

Page 7

... Ordering Information Chip form : CHA7010-99F/00 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S ...

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