ov9650 OmniVision Technologies, Inc, ov9650 Datasheet - Page 23

• Manufacturer Part Number: ov9650
• Description: Color Cmos Sxga 1.3 Megapixel Camerachiptm With Omnipixel
• Manufacturer: OmniVision Technologies, Inc

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Package Specifications
Figure 16 OV9650 Package Specifications
Version 1.91, January 28, 2005
Package Body Dimension X
Package Body Dimension Y
Package Height
Ball Height
Package Body Thickness
Thickness of Glass Surface to Wafer
Ball Diameter
Total Pin Count
Pin Count X-axis
Pin Count Y-axis
Pins Pitch X-axis
Pins Pitch Y-axis
Edge-to-Pin Center Distance Analog X
Edge-to-Pin Center Distance Analog Y
mni
The OV9650 uses a 28-pin Chip Scale Package (CSP). Refer to
dimensions and
Table 6
ision
Parameter
CSP Package Dimensions
Figure 17
B
C2
C1
Note: For OVT devices that contain lead, all part marking letters are
upper case. For OVT devices that are lead-free, all part marking letters
are lower case
1
for the array center on the chip.
Top View (Bumps Down)
Glass
2
Side View
A
3
4
Die
Symbol
5
C1
C2
C3
N1
N2
S1
S2
J1
J2
A
B
C
D
N
Center of the package
Center of BGA (die) =
A
B
C
D
E
F
C3
C
S2
J2
Proprietary to OmniVision Technologies
5070
5690
Min
760
150
605
395
320
918
828
S1
Figure 16
5
Part Marking Code:
W
X
Y
Z
ABCD
J1
Bottom View (Bumps Up)
-
-
-
-
-
4
OVT Product Version
Year the part is assembled
Month the part is assembled
Wafer number
Last four digits of lot number
for package information,
Nominal
28 (3 NC)
3
5095
5715
640
415
350
820
180
800
800
948
858
5
6
2
1
A
B
C
D
E
F
A1 Ball
Indicator
Max
5120
5740
880
210
675
435
380
978
888
Package Specifications
Table 6
for package
Unit
µm
µm
µm
µm
µm
µm
µm
µm
µm
µm
µm
23